JPH0263550U - - Google Patents
Info
- Publication number
- JPH0263550U JPH0263550U JP14334188U JP14334188U JPH0263550U JP H0263550 U JPH0263550 U JP H0263550U JP 14334188 U JP14334188 U JP 14334188U JP 14334188 U JP14334188 U JP 14334188U JP H0263550 U JPH0263550 U JP H0263550U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor pellets
- wires
- substrate
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 239000000463 material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係るハイブリツドＩＣ用リー
ドの拡大部分上面図、第２図はその拡大部分側面
図、第３図はプレス加工前の上記ハイブリツドＩ
Ｃ用リードの拡大部分上面図、第４図はその拡大
部分測面図である。また、第５図は樹脂モールド
タイプの混成集積回路装置に使用されるリードフ
レームの一例を示す部分斜視図、第６図は樹脂モ
ールドタイプの混成集積回路装置の一例を示す一
部分を断面にした斜視図、第７図イは混成集積回
路装置の略示平面図、第７図ロはモノリシツクＩ
Ｃの略示平面図である。
４……リード、９……ワイヤ、６……配線基板
、８……半導体ペレツト、１０……熱硬化性樹脂
材、１１……外装部、１２……混成集積回路装置
（ハイブリツドＩＣ）、１３……リード内端部、
１４……突起。
FIG. 1 is an enlarged top view of a lead for a hybrid IC according to the present invention, FIG. 2 is an enlarged side view of the lead, and FIG. 3 is the above hybrid IC before pressing.
FIG. 4 is a top view of an enlarged portion of the C lead, and FIG. 4 is a surface view of the enlarged portion. Furthermore, FIG. 5 is a partial perspective view showing an example of a lead frame used in a resin mold type hybrid integrated circuit device, and FIG. 6 is a partially cutaway perspective view showing an example of a resin mold type hybrid integrated circuit device. 7A is a schematic plan view of a hybrid integrated circuit device, and FIG. 7B is a monolithic integrated circuit device.
It is a schematic plan view of C. 4... Lead, 9... Wire, 6... Wiring board, 8... Semiconductor pellet, 10... Thermosetting resin material, 11... Exterior part, 12... Hybrid integrated circuit device (hybrid IC), 13 ...Lead inner end,
14... Protrusion.
Claims (1)
、基板周辺部に配置したリード端部と上記半導体
ペレツトとをワイヤにて電気的に接続し、上記半
導体ペレツトとリード端部を含む主要部分を樹脂
モールドしてなる混成集積回路装置において、 上記リードの長手方向と直交する内端部に、プ
レス加工による突起を形成したことを特徴とする
混成集積回路装置。[Claims for Utility Model Registration] A plurality of semiconductor pellets are mounted on a substrate, and the lead ends disposed around the substrate are electrically connected to the semiconductor pellets using wires, and the semiconductor pellets and the lead ends are electrically connected to each other by wires. What is claimed is: 1. A hybrid integrated circuit device comprising a main portion including a resin molded portion, wherein a protrusion is formed by press working on an inner end portion perpendicular to the longitudinal direction of the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14334188U JPH0263550U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14334188U JPH0263550U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263550U true JPH0263550U (en) | 1990-05-11 |
Family
ID=31410076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14334188U Pending JPH0263550U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263550U (en) |
-
1988
- 1988-10-31 JP JP14334188U patent/JPH0263550U/ja active Pending