JPH0212863B2 - - Google Patents

Info

Publication number
JPH0212863B2
JPH0212863B2 JP55038688A JP3868880A JPH0212863B2 JP H0212863 B2 JPH0212863 B2 JP H0212863B2 JP 55038688 A JP55038688 A JP 55038688A JP 3868880 A JP3868880 A JP 3868880A JP H0212863 B2 JPH0212863 B2 JP H0212863B2
Authority
JP
Japan
Prior art keywords
winding
spool
wire
pitch
windings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55038688A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56136764A (en
Inventor
Tamotsu Koizumi
Susumu Tomyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP3868880A priority Critical patent/JPS56136764A/ja
Publication of JPS56136764A publication Critical patent/JPS56136764A/ja
Publication of JPH0212863B2 publication Critical patent/JPH0212863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07502—
    • H10W72/5522—

Landscapes

  • Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)
  • Wire Bonding (AREA)
JP3868880A 1980-03-25 1980-03-25 Spooled gold wire for bonding semiconductor element Granted JPS56136764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3868880A JPS56136764A (en) 1980-03-25 1980-03-25 Spooled gold wire for bonding semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3868880A JPS56136764A (en) 1980-03-25 1980-03-25 Spooled gold wire for bonding semiconductor element

Publications (2)

Publication Number Publication Date
JPS56136764A JPS56136764A (en) 1981-10-26
JPH0212863B2 true JPH0212863B2 (enExample) 1990-03-28

Family

ID=12532227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3868880A Granted JPS56136764A (en) 1980-03-25 1980-03-25 Spooled gold wire for bonding semiconductor element

Country Status (1)

Country Link
JP (1) JPS56136764A (enExample)

Also Published As

Publication number Publication date
JPS56136764A (en) 1981-10-26

Similar Documents

Publication Publication Date Title
US7113067B2 (en) Wire-wound coil and method for manufacturing the same
JPS62269863A (ja) ワイヤー巻装スプール
JPH0212863B2 (enExample)
TWI603911B (zh) Winding structure of bonding wire for semiconductor device
JP3625185B2 (ja) 回転電機の固定子
JP2004111449A (ja) ボンディング用金極細線の巻回構造および巻回方法
JP3482058B2 (ja) 溶接用ワイヤの取り出し部材
JP3014931U (ja) 撚 線
JPH1027819A (ja) ボンディングワイヤーの巻き取り方法
JPH11124276A (ja) 半導体装置用ボンディングワイヤーの巻取方法
JPS6225489Y2 (enExample)
CN1033849C (zh) 一种带槽往复动程滚筒
JPS61106381A (ja) 多層綾巻き方法
JPS60154414A (ja) 成型平角撚線の製造装置
JPH04126044U (ja) 圧縮コイルバネ
JPS59108656A (ja) 炭素繊維パツケ−ジ
JPH11260154A (ja) 紙介在型ケーブル
JPH0211017B2 (enExample)
JPH09169472A (ja) 素線引出ガイド装置
JP3570696B2 (ja) ファインワイヤー用スプール
JPH05132227A (ja) 高速送出用巻取コイル
JPH03200676A (ja) スプール装置
JP3658751B2 (ja) 金属極細線供給用パッケージおよびその製造方法
JPH0541549Y2 (enExample)
JPH0346968A (ja) 平形ケーブルの巻取方法