JPH0212041Y2 - - Google Patents
Info
- Publication number
- JPH0212041Y2 JPH0212041Y2 JP1983111248U JP11124883U JPH0212041Y2 JP H0212041 Y2 JPH0212041 Y2 JP H0212041Y2 JP 1983111248 U JP1983111248 U JP 1983111248U JP 11124883 U JP11124883 U JP 11124883U JP H0212041 Y2 JPH0212041 Y2 JP H0212041Y2
- Authority
- JP
- Japan
- Prior art keywords
- brush
- polishing
- cleaning
- polishing cloth
- bristles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cleaning In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983111248U JPS6017947U (ja) | 1983-07-18 | 1983-07-18 | ポリシング装置の洗浄用ブラシ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983111248U JPS6017947U (ja) | 1983-07-18 | 1983-07-18 | ポリシング装置の洗浄用ブラシ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6017947U JPS6017947U (ja) | 1985-02-06 |
| JPH0212041Y2 true JPH0212041Y2 (enrdf_load_html_response) | 1990-04-04 |
Family
ID=30258391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983111248U Granted JPS6017947U (ja) | 1983-07-18 | 1983-07-18 | ポリシング装置の洗浄用ブラシ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6017947U (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3926673A1 (de) * | 1989-08-11 | 1991-02-14 | Wacker Chemitronic | Verfahren und vorrichtung zur poliertuchaufbereitung beim chemomechanischen polieren, insbesondere von halbleiterscheiben |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54112091A (en) * | 1978-02-22 | 1979-09-01 | Fujikoshi Kikai Kogyo Kk | Lap surface compensator of lapping machine |
-
1983
- 1983-07-18 JP JP1983111248U patent/JPS6017947U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6017947U (ja) | 1985-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0876853B1 (en) | Brush for scrubbing semiconductor wafers | |
| TWI623358B (zh) | 用於洗淨修整盤之刷子、洗淨裝置及洗淨方法 | |
| JPH11192461A (ja) | 流液式ワークカセット洗浄装置 | |
| US6142859A (en) | Polishing apparatus | |
| JPH0212041Y2 (enrdf_load_html_response) | ||
| CN112536713A (zh) | 一种保持环 | |
| JP3665486B2 (ja) | 床清掃機 | |
| JPH0234746B2 (enrdf_load_html_response) | ||
| JPS6190868A (ja) | 研磨装置 | |
| CN110587463A (zh) | 一种刀柄去污抛光仪 | |
| JP7405430B2 (ja) | 両面研磨装置 | |
| JP2007118146A (ja) | 定盤のパッド貼着面用ドレッサ及びパッド貼着面のドレッシング方法 | |
| CN210403663U (zh) | 去应力腐蚀机的芯片旋转装置 | |
| JPH09207064A (ja) | 両面研磨機用キャリアおよびこれを用いて被加工物の両面を研磨する方法 | |
| JPH0479790B2 (enrdf_load_html_response) | ||
| JP2009070932A (ja) | ウェハー洗浄装置およびウェハー洗浄方法 | |
| JP2551229B2 (ja) | マルチワイヤソーによる切断方法およびその装置 | |
| JPH0232110B2 (enrdf_load_html_response) | ||
| US3885548A (en) | Cutting wheel assembly | |
| CN219485253U (zh) | 一种半导体材料生产用打磨装置 | |
| JPS6218369Y2 (enrdf_load_html_response) | ||
| JPH07130009A (ja) | 洗浄装置 | |
| CN213781994U (zh) | 晶圆清洗刷和晶圆清洗装置 | |
| JPH059229B2 (enrdf_load_html_response) | ||
| JP2003231052A (ja) | フロアーポリッシュポリマー塗料剥離方法及びその装置 |