JPH02118946U - - Google Patents
Info
- Publication number
- JPH02118946U JPH02118946U JP2878489U JP2878489U JPH02118946U JP H02118946 U JPH02118946 U JP H02118946U JP 2878489 U JP2878489 U JP 2878489U JP 2878489 U JP2878489 U JP 2878489U JP H02118946 U JPH02118946 U JP H02118946U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- package
- insulating container
- lead terminal
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は第１図
に示すパツケージの絶縁基板の斜視図、第３図は
従来の半導体素子収納用パツケージの断面図、第
４図は第３図のパツケージの絶縁基体の平面図で
ある。
１：絶縁基体、２：蓋体、３：絶縁容器、７：
外部リード端子、８ａ，８ｂ，８ｃ，８ｄ：連結
部材、９ａ，９ｂ，９ｃ，９ｄ：金属部材。
FIG. 1 is a sectional view showing an embodiment of a package for storing semiconductor elements according to the present invention, FIG. 2 is a perspective view of an insulating substrate of the package shown in FIG. 1, and FIG. 3 is a view of a conventional package for storing semiconductor elements. FIG. 4 is a plan view of the insulating substrate of the package of FIG. 1: Insulating base, 2: Lid, 3: Insulating container, 7:
External lead terminals, 8a, 8b, 8c, 8d: connecting members, 9a, 9b, 9c, 9d: metal members.
Claims (1)
ド端子が突出して成る半導体素子収納用パツケー
ジにおいて、前記絶縁容器の各側辺より突出する
各部リード端子を各側辺毎に電気絶縁性の連結部
材で連結し、且つ各連結部材を前記外部リード端
子と熱膨張係数が実質的に同一な金属部材で連結
したことを特徴とする半導体素子収納用パツケー
ジ。 In a semiconductor element storage package comprising a plurality of external lead terminals protruding from each side of a rectangular insulating container, each lead terminal protruding from each side of the insulating container is connected electrically insulatingly to each side. 1. A package for housing a semiconductor element, characterized in that the connecting members are connected by a metal member having substantially the same coefficient of thermal expansion as the external lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989028784U JPH0713229Y2 (en) | 1989-03-14 | 1989-03-14 | Package for storing semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989028784U JPH0713229Y2 (en) | 1989-03-14 | 1989-03-14 | Package for storing semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02118946U true JPH02118946U (en) | 1990-09-25 |
| JPH0713229Y2 JPH0713229Y2 (en) | 1995-03-29 |
Family
ID=31252426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989028784U Expired - Lifetime JPH0713229Y2 (en) | 1989-03-14 | 1989-03-14 | Package for storing semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713229Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6489354A (en) * | 1987-09-29 | 1989-04-03 | Nec Corp | Flat package |
-
1989
- 1989-03-14 JP JP1989028784U patent/JPH0713229Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6489354A (en) * | 1987-09-29 | 1989-04-03 | Nec Corp | Flat package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0713229Y2 (en) | 1995-03-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |