JPH02118939U - - Google Patents
Info
- Publication number
- JPH02118939U JPH02118939U JP1989026181U JP2618189U JPH02118939U JP H02118939 U JPH02118939 U JP H02118939U JP 1989026181 U JP1989026181 U JP 1989026181U JP 2618189 U JP2618189 U JP 2618189U JP H02118939 U JPH02118939 U JP H02118939U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- lead frame
- thin metal
- expose
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W74/121—
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- H10W72/884—
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- H10W74/00—
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- H10W74/10—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989026181U JPH02118939U (enExample) | 1989-03-09 | 1989-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989026181U JPH02118939U (enExample) | 1989-03-09 | 1989-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118939U true JPH02118939U (enExample) | 1990-09-25 |
Family
ID=31247578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989026181U Pending JPH02118939U (enExample) | 1989-03-09 | 1989-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118939U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013004848A (ja) * | 2011-06-20 | 2013-01-07 | Semiconductor Components Industries Llc | 半導体装置およびその製造方法 |
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1989
- 1989-03-09 JP JP1989026181U patent/JPH02118939U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013004848A (ja) * | 2011-06-20 | 2013-01-07 | Semiconductor Components Industries Llc | 半導体装置およびその製造方法 |