JPH01163345U - - Google Patents
Info
- Publication number
- JPH01163345U JPH01163345U JP1988060397U JP6039788U JPH01163345U JP H01163345 U JPH01163345 U JP H01163345U JP 1988060397 U JP1988060397 U JP 1988060397U JP 6039788 U JP6039788 U JP 6039788U JP H01163345 U JPH01163345 U JP H01163345U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- island
- inner lead
- thin metal
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988060397U JPH01163345U (enExample) | 1988-05-06 | 1988-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988060397U JPH01163345U (enExample) | 1988-05-06 | 1988-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163345U true JPH01163345U (enExample) | 1989-11-14 |
Family
ID=31286104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988060397U Pending JPH01163345U (enExample) | 1988-05-06 | 1988-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163345U (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61240644A (ja) * | 1985-04-18 | 1986-10-25 | Nec Corp | 半導体装置 |
| JPS62128550A (ja) * | 1985-11-30 | 1987-06-10 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
| JPS6310569B2 (enExample) * | 1983-08-23 | 1988-03-08 | Tokyo Shibaura Electric Co |
-
1988
- 1988-05-06 JP JP1988060397U patent/JPH01163345U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310569B2 (enExample) * | 1983-08-23 | 1988-03-08 | Tokyo Shibaura Electric Co | |
| JPS61240644A (ja) * | 1985-04-18 | 1986-10-25 | Nec Corp | 半導体装置 |
| JPS62128550A (ja) * | 1985-11-30 | 1987-06-10 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |