JPH02118941U - - Google Patents
Info
- Publication number
- JPH02118941U JPH02118941U JP1989027777U JP2777789U JPH02118941U JP H02118941 U JPH02118941 U JP H02118941U JP 1989027777 U JP1989027777 U JP 1989027777U JP 2777789 U JP2777789 U JP 2777789U JP H02118941 U JPH02118941 U JP H02118941U
- Authority
- JP
- Japan
- Prior art keywords
- element mounting
- mounting board
- semiconductor pellet
- sealed
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5449—
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- H10W72/884—
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- H10W74/00—
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- H10W90/736—
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- H10W90/756—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989027777U JPH02118941U (enExample) | 1989-03-09 | 1989-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989027777U JPH02118941U (enExample) | 1989-03-09 | 1989-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118941U true JPH02118941U (enExample) | 1990-09-25 |
Family
ID=31250569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989027777U Pending JPH02118941U (enExample) | 1989-03-09 | 1989-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118941U (enExample) |
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1989
- 1989-03-09 JP JP1989027777U patent/JPH02118941U/ja active Pending