JPH02116744U - - Google Patents
Info
- Publication number
- JPH02116744U JPH02116744U JP1989024912U JP2491289U JPH02116744U JP H02116744 U JPH02116744 U JP H02116744U JP 1989024912 U JP1989024912 U JP 1989024912U JP 2491289 U JP2491289 U JP 2491289U JP H02116744 U JPH02116744 U JP H02116744U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- sealed
- heat sink
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第１図は本考案による一実施例を示す断面図で
、第２図は他の実施例を示す断面図である。第３
，４図は従来構造の断面図である。 １……半導体ペレツト、２……放熱板、３……
リード部、４……凹型絶縁物、５……絶縁性支持
ピン、６……吊りピン、７……支持ピン。
、第２図は他の実施例を示す断面図である。第３
，４図は従来構造の断面図である。 １……半導体ペレツト、２……放熱板、３……
リード部、４……凹型絶縁物、５……絶縁性支持
ピン、６……吊りピン、７……支持ピン。
Claims (1)
- 樹脂により気密封止された絶縁型半導体素子に
おいて、リードフレームの放熱板の１部に絶縁物
を設け、樹脂封止したことを特徴とする絶縁型半
導体素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024912U JPH02116744U (ja) | 1989-03-03 | 1989-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024912U JPH02116744U (ja) | 1989-03-03 | 1989-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02116744U true JPH02116744U (ja) | 1990-09-19 |
Family
ID=31245175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989024912U Pending JPH02116744U (ja) | 1989-03-03 | 1989-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116744U (ja) |
-
1989
- 1989-03-03 JP JP1989024912U patent/JPH02116744U/ja active Pending