JPS61106031U - - Google Patents
Info
- Publication number
- JPS61106031U JPS61106031U JP19325784U JP19325784U JPS61106031U JP S61106031 U JPS61106031 U JP S61106031U JP 19325784 U JP19325784 U JP 19325784U JP 19325784 U JP19325784 U JP 19325784U JP S61106031 U JPS61106031 U JP S61106031U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- metal heat
- resin layer
- insulated semiconductor
- insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案を説明する断面図、第２図は従
来例を説明する断面図である。 １は半導体ペレツト、２は金属放熱板、３は封
止樹脂層、４は第２樹脂層である。
来例を説明する断面図である。 １は半導体ペレツト、２は金属放熱板、３は封
止樹脂層、４は第２樹脂層である。
Claims (1)
- 半導体ペレツトが固着される金属放熱板と該金
属放熱板を完全に被覆する樹脂層とを具備する絶
縁型半導体素子に於いて、前記金属放熱板の裏面
に放熱性の良好な第２樹脂層を設けたことを特徴
とする絶縁型半導体素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19325784U JPS61106031U (ja) | 1984-12-19 | 1984-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19325784U JPS61106031U (ja) | 1984-12-19 | 1984-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61106031U true JPS61106031U (ja) | 1986-07-05 |
Family
ID=30750676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19325784U Pending JPS61106031U (ja) | 1984-12-19 | 1984-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61106031U (ja) |
-
1984
- 1984-12-19 JP JP19325784U patent/JPS61106031U/ja active Pending
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