JPS61171260U - - Google Patents

Info

Publication number
JPS61171260U
JPS61171260U JP5450385U JP5450385U JPS61171260U JP S61171260 U JPS61171260 U JP S61171260U JP 5450385 U JP5450385 U JP 5450385U JP 5450385 U JP5450385 U JP 5450385U JP S61171260 U JPS61171260 U JP S61171260U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor device
semiconductor elements
semiconductor
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5450385U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5450385U priority Critical patent/JPS61171260U/ja
Publication of JPS61171260U publication Critical patent/JPS61171260U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図および第2図はこの考案に係る半導体装
置の第1および第2実施例による概要構成を示す
それぞれ断面図であり、また第3図は同上従来例
による半導体装置の概要構成を示す断面図、第4
図および第5図a,bは同上装置冷却時での冷却
時間と過渡熱抵抗との関係を示すグラフ、および
その説明図である。 1,8…半導体素子、2…放熱器、6…金属体

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を放熱器に組付けて構成する半導体
    装置において、これらの半導体素子と放熱器との
    間に、適用対象装置などの使用条件によつて選択
    設定された熱容量をもつ熱伝導性良好な金属体を
    介在させたことを特徴とする半導体装置。
JP5450385U 1985-04-10 1985-04-10 Pending JPS61171260U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5450385U JPS61171260U (ja) 1985-04-10 1985-04-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5450385U JPS61171260U (ja) 1985-04-10 1985-04-10

Publications (1)

Publication Number Publication Date
JPS61171260U true JPS61171260U (ja) 1986-10-24

Family

ID=30576325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5450385U Pending JPS61171260U (ja) 1985-04-10 1985-04-10

Country Status (1)

Country Link
JP (1) JPS61171260U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100791A (ja) * 2009-11-04 2011-05-19 Toyota Motor Corp 冷却器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196041A (ja) * 1982-05-12 1983-11-15 Hitachi Ltd 熱伝達接続装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196041A (ja) * 1982-05-12 1983-11-15 Hitachi Ltd 熱伝達接続装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100791A (ja) * 2009-11-04 2011-05-19 Toyota Motor Corp 冷却器

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