JPH0211335U - - Google Patents

Info

Publication number
JPH0211335U
JPH0211335U JP1988088933U JP8893388U JPH0211335U JP H0211335 U JPH0211335 U JP H0211335U JP 1988088933 U JP1988088933 U JP 1988088933U JP 8893388 U JP8893388 U JP 8893388U JP H0211335 U JPH0211335 U JP H0211335U
Authority
JP
Japan
Prior art keywords
chip
integrated circuit
package
pads
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988088933U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988088933U priority Critical patent/JPH0211335U/ja
Publication of JPH0211335U publication Critical patent/JPH0211335U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/5449
    • H10W72/932

Landscapes

  • Design And Manufacture Of Integrated Circuits (AREA)
JP1988088933U 1988-07-04 1988-07-04 Pending JPH0211335U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988088933U JPH0211335U (enExample) 1988-07-04 1988-07-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988088933U JPH0211335U (enExample) 1988-07-04 1988-07-04

Publications (1)

Publication Number Publication Date
JPH0211335U true JPH0211335U (enExample) 1990-01-24

Family

ID=31313490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988088933U Pending JPH0211335U (enExample) 1988-07-04 1988-07-04

Country Status (1)

Country Link
JP (1) JPH0211335U (enExample)

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