JPH0211014B2 - - Google Patents

Info

Publication number
JPH0211014B2
JPH0211014B2 JP58014169A JP1416983A JPH0211014B2 JP H0211014 B2 JPH0211014 B2 JP H0211014B2 JP 58014169 A JP58014169 A JP 58014169A JP 1416983 A JP1416983 A JP 1416983A JP H0211014 B2 JPH0211014 B2 JP H0211014B2
Authority
JP
Japan
Prior art keywords
wire
strength
high temperature
annealing
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58014169A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59139663A (ja
Inventor
Akira Kyono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP58014169A priority Critical patent/JPS59139663A/ja
Publication of JPS59139663A publication Critical patent/JPS59139663A/ja
Publication of JPH0211014B2 publication Critical patent/JPH0211014B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H10W72/015—
    • H10W72/01551—
    • H10W72/01565—
    • H10W72/075—
    • H10W72/50—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/952—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
JP58014169A 1983-01-31 1983-01-31 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線 Granted JPS59139663A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58014169A JPS59139663A (ja) 1983-01-31 1983-01-31 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58014169A JPS59139663A (ja) 1983-01-31 1983-01-31 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線

Publications (2)

Publication Number Publication Date
JPS59139663A JPS59139663A (ja) 1984-08-10
JPH0211014B2 true JPH0211014B2 (esLanguage) 1990-03-12

Family

ID=11853636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58014169A Granted JPS59139663A (ja) 1983-01-31 1983-01-31 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線

Country Status (1)

Country Link
JP (1) JPS59139663A (esLanguage)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120693A (ja) * 1984-07-06 1986-01-29 Toshiba Corp ボンデイングワイヤ−
JPS6280241A (ja) * 1985-10-01 1987-04-13 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
US5000779A (en) * 1988-05-18 1991-03-19 Leach & Garner Palladium based powder-metal alloys and method for making same
JP4999887B2 (ja) * 2009-06-18 2012-08-15 株式会社関 高純度パラジウム製品、及びその鋳造方法
JP4866490B2 (ja) * 2009-06-24 2012-02-01 新日鉄マテリアルズ株式会社 半導体用銅合金ボンディングワイヤ
TWI486970B (zh) * 2013-01-29 2015-06-01 莊東漢 銅基合金線材及其製造方法
SG10201404628TA (en) * 2014-08-04 2016-03-30 Heraeus Deutschland Gmbh & Co Kg Ball-bond arrangement
JP2016211055A (ja) * 2015-05-12 2016-12-15 株式会社豊田中央研究所 接合電極、半導体素子及び電子部品
CN109777993B (zh) * 2019-02-26 2021-03-16 昆山全亚冠环保科技有限公司 一种铜金合金轧制工艺

Also Published As

Publication number Publication date
JPS59139663A (ja) 1984-08-10

Similar Documents

Publication Publication Date Title
US9972595B2 (en) Bonding wire for high-speed signal line
JPH0211013B2 (esLanguage)
JPH0211014B2 (esLanguage)
JPH0212022B2 (esLanguage)
JPS6112011B2 (esLanguage)
JP2008174779A (ja) ワイヤ材料およびその製造方法
JPH1187396A (ja) セリウムミッシュメタルを含有する金合金から成る極細線及びその製造方法
JPS6365036A (ja) 銅細線とその製造方法
JP3323185B2 (ja) 半導体素子接続用金線
JPH0245336B2 (esLanguage)
JPS62290835A (ja) 半導体装置のボンデイングワイヤ用Ａｕ合金極細線
JPH0572750B2 (esLanguage)
JP3014673B2 (ja) 半導体装置用リードフレーム
JP2779683B2 (ja) 半導体素子用ボンディングワイヤ
JPH0330462B2 (esLanguage)
JPS5826662B2 (ja) 半導体素子のボンデイング用金線
JPH0237698B2 (esLanguage)
JP2706539B2 (ja) ボンディングワイヤー
JP2661247B2 (ja) 半導体素子ボンディング用金合金細線
JP2000080426A (ja) 電子機器用銅合金
JPH0796321A (ja) 銀入り銅合金極細線の製造方法
JPH0131691B2 (esLanguage)
JPH0699791B2 (ja) 高強度・高導電型リードフレーム用金属板の製造方法
JPH0436430A (ja) ボンディングワイヤー
JPH0518892B2 (esLanguage)