JPH0237698B2 - - Google Patents

Info

Publication number
JPH0237698B2
JPH0237698B2 JP58075334A JP7533483A JPH0237698B2 JP H0237698 B2 JPH0237698 B2 JP H0237698B2 JP 58075334 A JP58075334 A JP 58075334A JP 7533483 A JP7533483 A JP 7533483A JP H0237698 B2 JPH0237698 B2 JP H0237698B2
Authority
JP
Japan
Prior art keywords
wire
thin
bonding
hardness
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58075334A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59201454A (ja
Inventor
Naoyuki Hosoda
Masayuki Tanaka
Tamotsu Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP58075334A priority Critical patent/JPS59201454A/ja
Publication of JPS59201454A publication Critical patent/JPS59201454A/ja
Publication of JPH0237698B2 publication Critical patent/JPH0237698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H10W72/50—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/952—

Landscapes

  • Wire Bonding (AREA)
JP58075334A 1983-04-28 1983-04-28 半導体装置のワイヤ・ボンデイング用Ｐｄ細線 Granted JPS59201454A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58075334A JPS59201454A (ja) 1983-04-28 1983-04-28 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58075334A JPS59201454A (ja) 1983-04-28 1983-04-28 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Publications (2)

Publication Number Publication Date
JPS59201454A JPS59201454A (ja) 1984-11-15
JPH0237698B2 true JPH0237698B2 (esLanguage) 1990-08-27

Family

ID=13573249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58075334A Granted JPS59201454A (ja) 1983-04-28 1983-04-28 半導体装置のワイヤ・ボンデイング用Ｐｄ細線

Country Status (1)

Country Link
JP (1) JPS59201454A (esLanguage)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2873770B2 (ja) * 1993-03-19 1999-03-24 新日本製鐵株式会社 半導体素子のワイヤボンディング用パラジウム細線
CN113241303A (zh) * 2021-05-19 2021-08-10 合肥矽格玛应用材料有限公司 封装键合铂金丝及其制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169342A (en) * 1980-05-31 1981-12-26 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor element

Also Published As

Publication number Publication date
JPS59201454A (ja) 1984-11-15

Similar Documents

Publication Publication Date Title
JP3382918B2 (ja) 半導体素子接続用金線
JP3328135B2 (ja) バンプ形成用金合金線及びバンプ形成方法
KR101280053B1 (ko) 고순도 동(銅) 본딩 와이어
JPH0211013B2 (esLanguage)
JPH0212022B2 (esLanguage)
JPS59139663A (ja) 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPH0237698B2 (esLanguage)
JPH0713273B2 (ja) 半導体素子用ボンディング線およびその製造方法
JP3323185B2 (ja) 半導体素子接続用金線
JPH03257129A (ja) 半導体装置のボンディング用金合金線
JPH11186314A (ja) ボンディングワイヤ
JPH0245336B2 (esLanguage)
JPH0412623B2 (esLanguage)
JPS62290835A (ja) 半導体装置のボンデイングワイヤ用Ａｕ合金極細線
JPS6112011B2 (esLanguage)
JPS5826662B2 (ja) 半導体素子のボンデイング用金線
JPS63235442A (ja) 銅細線及びその製造方法
JP3475511B2 (ja) ボンディングワイヤー
JPH0830229B2 (ja) 半導体装置のボンデイングワイヤ用Ａｕ合金極細線
JPS61224443A (ja) 半導体装置用ボンデイングワイヤ
JPH0131691B2 (esLanguage)
JP3615901B2 (ja) 半導体素子ボンディング用金合金線
JP3586909B2 (ja) ボンディングワイヤ
JP3907534B2 (ja) ボンディング用金合金線
JPS622645A (ja) 半導体装置用ボンデイングワイヤ