JPH02102725U - - Google Patents

Info

Publication number
JPH02102725U
JPH02102725U JP1204189U JP1204189U JPH02102725U JP H02102725 U JPH02102725 U JP H02102725U JP 1204189 U JP1204189 U JP 1204189U JP 1204189 U JP1204189 U JP 1204189U JP H02102725 U JPH02102725 U JP H02102725U
Authority
JP
Japan
Prior art keywords
cleaning
semiconductor wafer
cleaning solution
tank
replenished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1204189U
Other languages
English (en)
Other versions
JPH0749790Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989012041U priority Critical patent/JPH0749790Y2/ja
Publication of JPH02102725U publication Critical patent/JPH02102725U/ja
Application granted granted Critical
Publication of JPH0749790Y2 publication Critical patent/JPH0749790Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Description

【図面の簡単な説明】
第1図及び第2図は本考案の第1及び第2の実
施例の構成図である。 1……純水、2……加熱槽、3……液温計、4
……ヒーター、5……液温コントローラ、6……
補充液供給ポンプ、7……アンモニア水、8……
過酸化水素水、9……洗浄液、10……棒状ヒー
ター、11……洗浄槽、12……循環ポンプ、1
3……混合槽、14……エア駆動式バルブ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数の薬品溶液からなる洗浄液を洗浄槽に満し
    、定期的に洗浄液を補充しながら半導体ウエーハ
    を洗浄する半導体ウエーハの洗浄装置において、
    補充する洗浄液を加熱するための手段を設けたこ
    とを特徴とする半導体ウエーハの洗浄装置。
JP1989012041U 1989-02-02 1989-02-02 半導体ウェーハの洗浄装置 Expired - Lifetime JPH0749790Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989012041U JPH0749790Y2 (ja) 1989-02-02 1989-02-02 半導体ウェーハの洗浄装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989012041U JPH0749790Y2 (ja) 1989-02-02 1989-02-02 半導体ウェーハの洗浄装置

Publications (2)

Publication Number Publication Date
JPH02102725U true JPH02102725U (ja) 1990-08-15
JPH0749790Y2 JPH0749790Y2 (ja) 1995-11-13

Family

ID=31221128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989012041U Expired - Lifetime JPH0749790Y2 (ja) 1989-02-02 1989-02-02 半導体ウェーハの洗浄装置

Country Status (1)

Country Link
JP (1) JPH0749790Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109673107A (zh) * 2018-12-13 2019-04-23 重庆方正高密电子有限公司 褪洗设备和生产线

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215729A (ja) * 1983-05-21 1984-12-05 Ulvac Corp 半導体もしくは磁気記録媒体等の基板の洗浄装置
JPS63128186A (ja) * 1986-11-17 1988-05-31 Hitachi Ltd 湿式エツチング装置
JPS63272040A (ja) * 1987-04-30 1988-11-09 Fujitsu Ltd 循環濾過洗浄装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215729A (ja) * 1983-05-21 1984-12-05 Ulvac Corp 半導体もしくは磁気記録媒体等の基板の洗浄装置
JPS63128186A (ja) * 1986-11-17 1988-05-31 Hitachi Ltd 湿式エツチング装置
JPS63272040A (ja) * 1987-04-30 1988-11-09 Fujitsu Ltd 循環濾過洗浄装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109673107A (zh) * 2018-12-13 2019-04-23 重庆方正高密电子有限公司 褪洗设备和生产线

Also Published As

Publication number Publication date
JPH0749790Y2 (ja) 1995-11-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term