JPH02101551U - - Google Patents

Info

Publication number
JPH02101551U
JPH02101551U JP849189U JP849189U JPH02101551U JP H02101551 U JPH02101551 U JP H02101551U JP 849189 U JP849189 U JP 849189U JP 849189 U JP849189 U JP 849189U JP H02101551 U JPH02101551 U JP H02101551U
Authority
JP
Japan
Prior art keywords
semiconductor
wiring board
recess
semiconductor device
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP849189U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP849189U priority Critical patent/JPH02101551U/ja
Publication of JPH02101551U publication Critical patent/JPH02101551U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の第１実施例の半導体装置
の要部断面図、第２図は、この考案の第２実施例
の半導体装置の要部断面図である。第３図は、従
来の半導体装置の要部断面図である。 １……配線基板、２……凹部、３……半導体素
子、４……金属細線、５……配線基板の電極ラン
ド部、６……半導体素子の電極部、７……配線基
板、８……２段凹部、９……半導体素子Ａ、１０
……裏面電極、１１……半導体素子Ｂ。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 配線基板上に複数の半導体素子を搭載した
    半導体装置において、 配線基板の半導体素子搭載部に、該半導体素子
    の厚さと同程度の深さの凹部を形成し、該凹部に
    半導体素子を埋入して搭載したことを特徴とする
    半導体装置。 (2) 配線基板の半導体素子搭載凹部が多段に形
    成され、各段に搭載した半導体素子同士の電極部
    が重ね合うように配置し、半導体素子間を電気的
    に直接接合したことを特徴とする請求項第(1)項
    記載の半導体装置。
JP849189U 1989-01-27 1989-01-27 Pending JPH02101551U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP849189U JPH02101551U (ja) 1989-01-27 1989-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP849189U JPH02101551U (ja) 1989-01-27 1989-01-27

Publications (1)

Publication Number Publication Date
JPH02101551U true JPH02101551U (ja) 1990-08-13

Family

ID=31214412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP849189U Pending JPH02101551U (ja) 1989-01-27 1989-01-27

Country Status (1)

Country Link
JP (1) JPH02101551U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11262537A (ja) * 1997-12-12 1999-09-28 Ela Medical Sa 能動植え込み型医療装置の電子回路ならびにその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11262537A (ja) * 1997-12-12 1999-09-28 Ela Medical Sa 能動植え込み型医療装置の電子回路ならびにその製造方法

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