JPH01160836U - - Google Patents
Info
- Publication number
- JPH01160836U JPH01160836U JP4957088U JP4957088U JPH01160836U JP H01160836 U JPH01160836 U JP H01160836U JP 4957088 U JP4957088 U JP 4957088U JP 4957088 U JP4957088 U JP 4957088U JP H01160836 U JPH01160836 U JP H01160836U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- circuit
- hybrid integrated
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 2
- 230000007547 defect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
Description
第１図ａは本考案の一実施例の平面図、第１図
ｂはその正面図、第２図は従来構成を示す正面図
、第３図は従来の不具合を示す一部の拡大正面図
である。 １…基板、２Ａ，２Ｂ…回路、３…電子部品、
４…金属ワイヤ、５…メタルダイ。
ｂはその正面図、第２図は従来構成を示す正面図
、第３図は従来の不具合を示す一部の拡大正面図
である。 １…基板、２Ａ，２Ｂ…回路、３…電子部品、
４…金属ワイヤ、５…メタルダイ。
Claims (1)
- 基板上に搭載した電子部品を、該基板上に設け
た回路に金属ワイヤで電気接続する混成集積回路
において、前記回路上に電子部品と略等しい高さ
のメタルダイを搭載し、このメタルダイと電子部
品とを金属ワイヤで接続する構成としたことを特
徴とする混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4957088U JPH01160836U (ja) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4957088U JPH01160836U (ja) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160836U true JPH01160836U (ja) | 1989-11-08 |
Family
ID=31275660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4957088U Pending JPH01160836U (ja) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160836U (ja) |
-
1988
- 1988-04-13 JP JP4957088U patent/JPH01160836U/ja active Pending