JPH0193134A - リードフレーム押え装置 - Google Patents

リードフレーム押え装置

Info

Publication number
JPH0193134A
JPH0193134A JP62250979A JP25097987A JPH0193134A JP H0193134 A JPH0193134 A JP H0193134A JP 62250979 A JP62250979 A JP 62250979A JP 25097987 A JP25097987 A JP 25097987A JP H0193134 A JPH0193134 A JP H0193134A
Authority
JP
Japan
Prior art keywords
lead frame
stay
frame holding
holding plate
fixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62250979A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0474861B2 (enrdf_load_stackoverflow
Inventor
Takeo Sato
武雄 佐藤
Kenji Hashimoto
賢二 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP62250979A priority Critical patent/JPH0193134A/ja
Publication of JPH0193134A publication Critical patent/JPH0193134A/ja
Publication of JPH0474861B2 publication Critical patent/JPH0474861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Wire Bonding (AREA)
JP62250979A 1987-10-05 1987-10-05 リードフレーム押え装置 Granted JPH0193134A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62250979A JPH0193134A (ja) 1987-10-05 1987-10-05 リードフレーム押え装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62250979A JPH0193134A (ja) 1987-10-05 1987-10-05 リードフレーム押え装置

Publications (2)

Publication Number Publication Date
JPH0193134A true JPH0193134A (ja) 1989-04-12
JPH0474861B2 JPH0474861B2 (enrdf_load_stackoverflow) 1992-11-27

Family

ID=17215868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62250979A Granted JPH0193134A (ja) 1987-10-05 1987-10-05 リードフレーム押え装置

Country Status (1)

Country Link
JP (1) JPH0193134A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281794A (en) * 1990-05-25 1994-01-25 Kabushiki Kaisha Shinkawa Heater block for use in a bonder utilizing vacuum suction attachment means

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11846013B2 (en) * 2020-07-31 2023-12-19 Applied Materials, Inc. Methods and apparatus for extended chamber for through silicon via deposition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281794A (en) * 1990-05-25 1994-01-25 Kabushiki Kaisha Shinkawa Heater block for use in a bonder utilizing vacuum suction attachment means

Also Published As

Publication number Publication date
JPH0474861B2 (enrdf_load_stackoverflow) 1992-11-27

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Legal Events

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