JPH0474861B2 - - Google Patents

Info

Publication number
JPH0474861B2
JPH0474861B2 JP25097987A JP25097987A JPH0474861B2 JP H0474861 B2 JPH0474861 B2 JP H0474861B2 JP 25097987 A JP25097987 A JP 25097987A JP 25097987 A JP25097987 A JP 25097987A JP H0474861 B2 JPH0474861 B2 JP H0474861B2
Authority
JP
Japan
Prior art keywords
lead frame
frame holding
holding plate
mounting jig
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP25097987A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0193134A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP62250979A priority Critical patent/JPH0193134A/ja
Publication of JPH0193134A publication Critical patent/JPH0193134A/ja
Publication of JPH0474861B2 publication Critical patent/JPH0474861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Wire Bonding (AREA)
JP62250979A 1987-10-05 1987-10-05 リードフレーム押え装置 Granted JPH0193134A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62250979A JPH0193134A (ja) 1987-10-05 1987-10-05 リードフレーム押え装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62250979A JPH0193134A (ja) 1987-10-05 1987-10-05 リードフレーム押え装置

Publications (2)

Publication Number Publication Date
JPH0193134A JPH0193134A (ja) 1989-04-12
JPH0474861B2 true JPH0474861B2 (enrdf_load_stackoverflow) 1992-11-27

Family

ID=17215868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62250979A Granted JPH0193134A (ja) 1987-10-05 1987-10-05 リードフレーム押え装置

Country Status (1)

Country Link
JP (1) JPH0193134A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11846013B2 (en) * 2020-07-31 2023-12-19 Applied Materials, Inc. Methods and apparatus for extended chamber for through silicon via deposition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281794A (en) * 1990-05-25 1994-01-25 Kabushiki Kaisha Shinkawa Heater block for use in a bonder utilizing vacuum suction attachment means

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11846013B2 (en) * 2020-07-31 2023-12-19 Applied Materials, Inc. Methods and apparatus for extended chamber for through silicon via deposition

Also Published As

Publication number Publication date
JPH0193134A (ja) 1989-04-12

Similar Documents

Publication Publication Date Title
US5348316A (en) Die collet with cavity wall recess
US6237830B1 (en) Quick change precisor
JPH0474861B2 (enrdf_load_stackoverflow)
JP4832199B2 (ja) 基板バックアップ装置製造装置および製造方法ならびその製造方法によって製造された基板バックアップ装置
JP2000210730A (ja) Ｉｃ用リ―ドフレ―ムの加工用金型
JP3472336B2 (ja) ダイシング装置及びダイシング方法
JPH09148369A (ja) ボンディング装置用クランプ機構
JPH0528035U (ja) リードフレームマガジン
JPH04273138A (ja) フレーム押え固定装置
CN209394116U (zh) 线切割设备的免校正治具
JP3020190B2 (ja) リードフレーム押え装置
CN221754984U (zh) 一种壳体焊接装置
JPS5941077Y2 (ja) 射出成形機の金型案内及び位置決め装置
US20230314501A1 (en) Method for aligning contact pins in an integrated circuit testing apparatus
CN215967527U (zh) 多工序快速定位加工夹具
JPH019168Y2 (enrdf_load_stackoverflow)
JPH0314076Y2 (enrdf_load_stackoverflow)
KR960009290Y1 (ko) 와이어 본더의 리드 프레임 클램핑 장치
CN115026786A (zh) 自定心划线工装
JPH0634300U (ja) 電子部品装着装置
JPH0216743A (ja) ワーク加熱送り装置
JPH02273949A (ja) テープボンデイング装置
KR20250036569A (ko) 이차전지 제조 공정용 캐리어의 젤리롤 상판 평탄도 조절장치 및 젤리롤 상판 평탄도 조절방법
JP2799727B2 (ja) 電子部品のリード矯正装置
JPS6163395U (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees