JPH0178963U - - Google Patents
Info
- Publication number
- JPH0178963U JPH0178963U JP1987174488U JP17448887U JPH0178963U JP H0178963 U JPH0178963 U JP H0178963U JP 1987174488 U JP1987174488 U JP 1987174488U JP 17448887 U JP17448887 U JP 17448887U JP H0178963 U JPH0178963 U JP H0178963U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- component
- board
- test head
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000007689 inspection Methods 0.000 claims description 3
- 238000011990 functional testing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
第1図は本考案による半導体部品検査装置の概
略構成を示す説明図、第2図はパフオーマンスボ
ード及びソケツトボードの具体的な構造例を示す
分解斜視図、第3図は防塵シートを示す平面図、
第4図は個別シートを示す平面図、第5図は防塵
シートの上面にて各ソケツトボードの位置に個別
シートを重ねて被せた状態を示す部分拡大説明図
、第6図は従来の半導体部品検査装置の概略構成
を示す説明図である。
1……電子回路基板、2……テストヘツド、3
……パフオーマンスボード、4……部品ソケツト
、5……ソケツトボード、6……オートハンドラ
、10……防塵シート、11……防塵シートの大
きめの逃げ孔、12……個別シート、13……個
別シートのぎりぎりの逃げ孔。
FIG. 1 is an explanatory diagram showing a schematic configuration of a semiconductor component inspection apparatus according to the present invention, FIG. 2 is an exploded perspective view showing a specific structural example of a performance board and a socket board, and FIG. 3 is a plan view showing a dustproof sheet.
Fig. 4 is a plan view showing the individual sheets, Fig. 5 is a partially enlarged explanatory view showing the state in which the individual sheets are overlapped and covered at the position of each socket board on the top surface of the dustproof sheet, and Fig. 6 is a conventional semiconductor component inspection. FIG. 2 is an explanatory diagram showing a schematic configuration of the device. 1...Electronic circuit board, 2...Test head, 3
... Performance board, 4 ... Parts socket, 5 ... Socket board, 6 ... Auto handler, 10 ... Dust-proof sheet, 11 ... Large escape hole of dust-proof sheet, 12 ... Individual sheet, 13 ... Individual sheet A narrow escape hole.
Claims (1)
数枚内蔵したテストヘツドと、このテストヘツド
の上面側に固定され検査対象の半導体部品を上記
テストヘツド内の電子回路基板に接続するための
パフオーマンスボードと、このパフオーマンスボ
ードの上方に支持されると共に該パフオーマンス
ボードに信号線で接続され複数個の部品ソケツト
が列設され且つ全体が所定の範囲内で可動とされ
た複数個のソケツトボードとを有し、これらのソ
ケツトボードの上方に位置するオートハンドラに
よつて半導体部品を各部品ソケツトに差し込んで
機能検査する半導体部品検査装置において、上記
複数個のソケツトボード全体の上面に個々の部品
ソケツトの位置を逃げる大きめの逃げ孔を設けた
絶縁性及び耐熱性を有する防塵シートを被せると
共に、この防塵シートの上面にて各ソケツトボー
ドの位置には個々の部品ソケツトの外周部に沿つ
てぎりぎりの逃げ孔を設けた絶縁性及び耐熱性を
有する個別シートを重ねて被せたことを特徴とす
る半導体部品検査装置。 A test head incorporating a plurality of electronic circuit boards for testing semiconductor components; a performance board fixed to the upper surface of the test head for connecting semiconductor components to be tested to the electronic circuit boards in the test head; A plurality of socket boards supported above the board, connected to the performance board by signal lines, having a plurality of component sockets arranged in rows, and movable as a whole within a predetermined range; In a semiconductor component testing device that performs a functional test by inserting a semiconductor component into each component socket using an autohandler located above, a large escape hole is provided on the top surface of the entire plurality of socket boards to escape the position of each component socket. At the same time, on the top surface of this dustproof sheet, each socket board is covered with an insulating and heat-resistant dustproof sheet with a narrow escape hole along the outer periphery of each component socket. What is claimed is: 1. A semiconductor component inspection device characterized by overlapping and covering individual sheets having
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987174488U JPH0178963U (en) | 1987-11-17 | 1987-11-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987174488U JPH0178963U (en) | 1987-11-17 | 1987-11-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0178963U true JPH0178963U (en) | 1989-05-26 |
Family
ID=31466342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987174488U Pending JPH0178963U (en) | 1987-11-17 | 1987-11-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0178963U (en) |
-
1987
- 1987-11-17 JP JP1987174488U patent/JPH0178963U/ja active Pending
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