JPS61205086U - - Google Patents

Info

Publication number
JPS61205086U
JPS61205086U JP8920485U JP8920485U JPS61205086U JP S61205086 U JPS61205086 U JP S61205086U JP 8920485 U JP8920485 U JP 8920485U JP 8920485 U JP8920485 U JP 8920485U JP S61205086 U JPS61205086 U JP S61205086U
Authority
JP
Japan
Prior art keywords
test board
top cover
burn
semiconductor device
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8920485U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8920485U priority Critical patent/JPS61205086U/ja
Publication of JPS61205086U publication Critical patent/JPS61205086U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を半導体素子を配置
した状態で示す一部省略斜視図、第2図は同上の
―断面図、第3図は本考案の他の実施例を示
す一部省略断面図、第4図は本考案の更に他の実
施例を示す一部省略断面図、第5図は従来例にお
けるソケツトを示す斜視図であつて、1は半導体
素子、2は試験基板、3は上蓋、4は接続端子、
5は弾性体である。
Fig. 1 is a partially omitted perspective view showing one embodiment of the present invention with semiconductor elements arranged, Fig. 2 is a sectional view of the same as above, and Fig. 3 is a partial view showing another embodiment of the present invention. 4 is a partially omitted sectional view showing still another embodiment of the present invention, and FIG. 5 is a perspective view showing a conventional socket, in which 1 is a semiconductor element, 2 is a test board, 3 is the top cover, 4 is the connection terminal,
5 is an elastic body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を配置する試験基板と、試験基板に
被嵌させる上蓋とから成り、上蓋の下面側より半
導体素子の接続端子を押圧して試験基板に電気的
に接続させる弾性体を突出させて成るバーンイン
テスト用試験器具。
A burn-in burn-in device consists of a test board on which a semiconductor device is placed and a top cover that fits over the test board, and an elastic body protrudes from the bottom side of the top cover to press the connection terminal of the semiconductor device and electrically connect it to the test board. Test equipment for testing.
JP8920485U 1985-06-13 1985-06-13 Pending JPS61205086U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8920485U JPS61205086U (en) 1985-06-13 1985-06-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8920485U JPS61205086U (en) 1985-06-13 1985-06-13

Publications (1)

Publication Number Publication Date
JPS61205086U true JPS61205086U (en) 1986-12-24

Family

ID=30643055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8920485U Pending JPS61205086U (en) 1985-06-13 1985-06-13

Country Status (1)

Country Link
JP (1) JPS61205086U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8917768B2 (en) 2003-07-18 2014-12-23 Microsoft Corporation Coding of motion vector information

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8917768B2 (en) 2003-07-18 2014-12-23 Microsoft Corporation Coding of motion vector information
US9148668B2 (en) 2003-07-18 2015-09-29 Microsoft Technology Licensing, Llc Coding of motion vector information

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