JPH0178058U - - Google Patents

Info

Publication number
JPH0178058U
JPH0178058U JP1987172071U JP17207187U JPH0178058U JP H0178058 U JPH0178058 U JP H0178058U JP 1987172071 U JP1987172071 U JP 1987172071U JP 17207187 U JP17207187 U JP 17207187U JP H0178058 U JPH0178058 U JP H0178058U
Authority
JP
Japan
Prior art keywords
lead
reflecting mirror
pellet
optical semiconductor
die island
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987172071U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987172071U priority Critical patent/JPH0178058U/ja
Publication of JPH0178058U publication Critical patent/JPH0178058U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1987172071U 1987-11-12 1987-11-12 Pending JPH0178058U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987172071U JPH0178058U (enExample) 1987-11-12 1987-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987172071U JPH0178058U (enExample) 1987-11-12 1987-11-12

Publications (1)

Publication Number Publication Date
JPH0178058U true JPH0178058U (enExample) 1989-05-25

Family

ID=31464062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987172071U Pending JPH0178058U (enExample) 1987-11-12 1987-11-12

Country Status (1)

Country Link
JP (1) JPH0178058U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04165673A (ja) * 1990-10-30 1992-06-11 Nec Corp 固体撮像装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5546573A (en) * 1978-09-30 1980-04-01 Toshiba Corp Electrode member for light emission device, method of fabricating the same and punch therefor
JPS58220480A (ja) * 1982-06-16 1983-12-22 Toshiba Corp 光半導体装置
JPS59224185A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体発光装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5546573A (en) * 1978-09-30 1980-04-01 Toshiba Corp Electrode member for light emission device, method of fabricating the same and punch therefor
JPS58220480A (ja) * 1982-06-16 1983-12-22 Toshiba Corp 光半導体装置
JPS59224185A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04165673A (ja) * 1990-10-30 1992-06-11 Nec Corp 固体撮像装置

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