JPH0178037U - - Google Patents
Info
- Publication number
- JPH0178037U JPH0178037U JP1987173903U JP17390387U JPH0178037U JP H0178037 U JPH0178037 U JP H0178037U JP 1987173903 U JP1987173903 U JP 1987173903U JP 17390387 U JP17390387 U JP 17390387U JP H0178037 U JPH0178037 U JP H0178037U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- semiconductor
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000003302 ferromagnetic material Substances 0.000 claims description 3
- 230000005294 ferromagnetic effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173903U JPH0178037U (uk) | 1987-11-16 | 1987-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173903U JPH0178037U (uk) | 1987-11-16 | 1987-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178037U true JPH0178037U (uk) | 1989-05-25 |
Family
ID=31465788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987173903U Pending JPH0178037U (uk) | 1987-11-16 | 1987-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178037U (uk) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997040654A1 (fr) * | 1996-04-24 | 1997-10-30 | Okamura, Susumu | Dispositif a semi-conducteurs |
| WO2003034496A1 (fr) * | 2001-10-16 | 2003-04-24 | Sony Corporation | Enregistreur d'informations et appareil electronique a enregistreur d'informations monte |
-
1987
- 1987-11-16 JP JP1987173903U patent/JPH0178037U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997040654A1 (fr) * | 1996-04-24 | 1997-10-30 | Okamura, Susumu | Dispositif a semi-conducteurs |
| KR100367069B1 (ko) * | 1996-04-24 | 2003-03-29 | 이케다 타케시 | 반도체장치 |
| WO2003034496A1 (fr) * | 2001-10-16 | 2003-04-24 | Sony Corporation | Enregistreur d'informations et appareil electronique a enregistreur d'informations monte |
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