JPH0178037U - - Google Patents

Info

Publication number
JPH0178037U
JPH0178037U JP1987173903U JP17390387U JPH0178037U JP H0178037 U JPH0178037 U JP H0178037U JP 1987173903 U JP1987173903 U JP 1987173903U JP 17390387 U JP17390387 U JP 17390387U JP H0178037 U JPH0178037 U JP H0178037U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
semiconductor
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987173903U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987173903U priority Critical patent/JPH0178037U/ja
Publication of JPH0178037U publication Critical patent/JPH0178037U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP1987173903U 1987-11-16 1987-11-16 Pending JPH0178037U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987173903U JPH0178037U (enExample) 1987-11-16 1987-11-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987173903U JPH0178037U (enExample) 1987-11-16 1987-11-16

Publications (1)

Publication Number Publication Date
JPH0178037U true JPH0178037U (enExample) 1989-05-25

Family

ID=31465788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987173903U Pending JPH0178037U (enExample) 1987-11-16 1987-11-16

Country Status (1)

Country Link
JP (1) JPH0178037U (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997040654A1 (en) * 1996-04-24 1997-10-30 Okamura, Susumu Semiconductor device
WO2003034496A1 (en) * 2001-10-16 2003-04-24 Sony Corporation Information recorder and electronic apparatus with mounted information recorder

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753644B2 (enExample) * 1980-06-24 1982-11-13
JPS59155154A (ja) * 1983-02-23 1984-09-04 Nec Corp 半導体装置
JPS6219746B2 (enExample) * 1979-12-29 1987-04-30 Ricoh Kk

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6219746B2 (enExample) * 1979-12-29 1987-04-30 Ricoh Kk
JPS5753644B2 (enExample) * 1980-06-24 1982-11-13
JPS59155154A (ja) * 1983-02-23 1984-09-04 Nec Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997040654A1 (en) * 1996-04-24 1997-10-30 Okamura, Susumu Semiconductor device
KR100367069B1 (ko) * 1996-04-24 2003-03-29 이케다 타케시 반도체장치
WO2003034496A1 (en) * 2001-10-16 2003-04-24 Sony Corporation Information recorder and electronic apparatus with mounted information recorder

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