JPH0165141U - - Google Patents
Info
- Publication number
- JPH0165141U JPH0165141U JP1987160528U JP16052887U JPH0165141U JP H0165141 U JPH0165141 U JP H0165141U JP 1987160528 U JP1987160528 U JP 1987160528U JP 16052887 U JP16052887 U JP 16052887U JP H0165141 U JPH0165141 U JP H0165141U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- contact
- semiconductor element
- mounting surface
- protruding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Description
第１図は本考案の第一実施例を示す分解斜視図
、第２図は本考案の作用説明図、第３図は本考案
の第二実施例を示す分解斜視図、第４図は従来技
術の説明図である。
第１図において、１は放熱器、２は放熱器取付
面、３は棚部、４，５，６は半導体素子パツケー
ジ、７，８，・・・１５はピン、１６，１７，１
８は半導体素子パツケージ底面、１９，２０，２
１は半導体素子パツケージ背面、６０は当接壁で
ある。
Fig. 1 is an exploded perspective view showing the first embodiment of the invention, Fig. 2 is an explanatory diagram of the operation of the invention, Fig. 3 is an exploded perspective view showing the second embodiment of the invention, and Fig. 4 is a conventional It is an explanatory diagram of the technique. In FIG. 1, 1 is a heatsink, 2 is a heatsink mounting surface, 3 is a shelf, 4, 5, 6 are semiconductor element packages, 7, 8, . . . 15 are pins, 16, 17, 1
8 is the bottom surface of the semiconductor element package, 19, 20, 2
Reference numeral 1 indicates the back surface of the semiconductor element package, and reference numeral 60 indicates an abutment wall.
Claims (1)
体の少なくとも一側端縁が当接する当接壁６０を
突設してなる半導体用放熱器。 A heat radiator for a semiconductor, which has a contact wall 60 protruding from a mounting surface 2 on which a semiconductor element is mounted, with which at least one edge of the semiconductor comes into contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160528U JPH0165141U (en) | 1987-10-20 | 1987-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160528U JPH0165141U (en) | 1987-10-20 | 1987-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165141U true JPH0165141U (en) | 1989-04-26 |
Family
ID=31442667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987160528U Pending JPH0165141U (en) | 1987-10-20 | 1987-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165141U (en) |
-
1987
- 1987-10-20 JP JP1987160528U patent/JPH0165141U/ja active Pending
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