JPH0160532U - - Google Patents

Info

Publication number
JPH0160532U
JPH0160532U JP15710387U JP15710387U JPH0160532U JP H0160532 U JPH0160532 U JP H0160532U JP 15710387 U JP15710387 U JP 15710387U JP 15710387 U JP15710387 U JP 15710387U JP H0160532 U JPH0160532 U JP H0160532U
Authority
JP
Japan
Prior art keywords
chemical liquid
liquid processing
processing apparatus
semiconductor substrates
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15710387U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15710387U priority Critical patent/JPH0160532U/ja
Publication of JPH0160532U publication Critical patent/JPH0160532U/ja
Pending legal-status Critical Current

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  • Weting (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の縦断面図である。 １……薬液処理槽、２……薬液、３……配管、
４……ノズル、５……気泡、Ａ……対流。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数の半導体基板と浸漬し薬液処理する薬液処
    理装置において、薬液処理槽内に薬液撹拌の気泡
    発生機構を有することを特徴とする半導体基板の
    薬液処理装置。
JP15710387U 1987-10-13 1987-10-13 Pending JPH0160532U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15710387U JPH0160532U (ja) 1987-10-13 1987-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15710387U JPH0160532U (ja) 1987-10-13 1987-10-13

Publications (1)

Publication Number Publication Date
JPH0160532U true JPH0160532U (ja) 1989-04-17

Family

ID=31436252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15710387U Pending JPH0160532U (ja) 1987-10-13 1987-10-13

Country Status (1)

Country Link
JP (1) JPH0160532U (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50141270A (ja) * 1974-04-30 1975-11-13
JPS5441674A (en) * 1977-09-09 1979-04-03 Hitachi Ltd Etching method
JPS5617021A (en) * 1979-07-20 1981-02-18 Fujitsu Ltd Surface treatment of substrate
JPS6034538B2 (ja) * 1977-05-02 1985-08-09 塩野義製薬株式会社 ２−クロル−２−ヒドロキシイミノ酢酸アルキルエステルの合成法
JPS6039242B2 (ja) * 1978-06-29 1985-09-05 花王株式会社 殺線虫剤
JPS6180825A (ja) * 1984-09-28 1986-04-24 Hitachi Ltd 液体処理装置
JPS61218416A (ja) * 1985-03-22 1986-09-27 Mitsubishi Electric Corp 自動車用暖房装置
JPS62132325A (ja) * 1985-12-05 1987-06-15 Tdk Corp ウエフアのエツチング方法およびそれに用いるウエフア・キヤリア
JPS6346212B2 (ja) * 1984-01-23 1988-09-14 Kogyo Gijutsuin

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50141270A (ja) * 1974-04-30 1975-11-13
JPS6034538B2 (ja) * 1977-05-02 1985-08-09 塩野義製薬株式会社 ２−クロル−２−ヒドロキシイミノ酢酸アルキルエステルの合成法
JPS5441674A (en) * 1977-09-09 1979-04-03 Hitachi Ltd Etching method
JPS6039242B2 (ja) * 1978-06-29 1985-09-05 花王株式会社 殺線虫剤
JPS5617021A (en) * 1979-07-20 1981-02-18 Fujitsu Ltd Surface treatment of substrate
JPS6346212B2 (ja) * 1984-01-23 1988-09-14 Kogyo Gijutsuin
JPS6180825A (ja) * 1984-09-28 1986-04-24 Hitachi Ltd 液体処理装置
JPS61218416A (ja) * 1985-03-22 1986-09-27 Mitsubishi Electric Corp 自動車用暖房装置
JPS62132325A (ja) * 1985-12-05 1987-06-15 Tdk Corp ウエフアのエツチング方法およびそれに用いるウエフア・キヤリア

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