JPH0158861B2 - - Google Patents
Info
- Publication number
- JPH0158861B2 JPH0158861B2 JP57225666A JP22566682A JPH0158861B2 JP H0158861 B2 JPH0158861 B2 JP H0158861B2 JP 57225666 A JP57225666 A JP 57225666A JP 22566682 A JP22566682 A JP 22566682A JP H0158861 B2 JPH0158861 B2 JP H0158861B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- ball
- thin
- arc
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/0711—
-
- H10W72/01551—
-
- H10W72/07141—
-
- H10W72/075—
-
- H10W72/07511—
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- H10W72/07541—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/5524—
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- H10W72/59—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57225666A JPS59113633A (ja) | 1982-12-20 | 1982-12-20 | ワイヤボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57225666A JPS59113633A (ja) | 1982-12-20 | 1982-12-20 | ワイヤボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59113633A JPS59113633A (ja) | 1984-06-30 |
| JPH0158861B2 true JPH0158861B2 (enExample) | 1989-12-13 |
Family
ID=16832872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57225666A Granted JPS59113633A (ja) | 1982-12-20 | 1982-12-20 | ワイヤボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59113633A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6491203B2 (en) | 1999-11-30 | 2002-12-10 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus |
-
1982
- 1982-12-20 JP JP57225666A patent/JPS59113633A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6491203B2 (en) | 1999-11-30 | 2002-12-10 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59113633A (ja) | 1984-06-30 |
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