JPH0156360B2 - - Google Patents
Info
- Publication number
- JPH0156360B2 JPH0156360B2 JP55016168A JP1616880A JPH0156360B2 JP H0156360 B2 JPH0156360 B2 JP H0156360B2 JP 55016168 A JP55016168 A JP 55016168A JP 1616880 A JP1616880 A JP 1616880A JP H0156360 B2 JPH0156360 B2 JP H0156360B2
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- heat
- electronic component
- container
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1616880A JPS56113994A (en) | 1980-02-13 | 1980-02-13 | Heat-pipe container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1616880A JPS56113994A (en) | 1980-02-13 | 1980-02-13 | Heat-pipe container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56113994A JPS56113994A (en) | 1981-09-08 |
| JPH0156360B2 true JPH0156360B2 (OSRAM) | 1989-11-29 |
Family
ID=11908972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1616880A Granted JPS56113994A (en) | 1980-02-13 | 1980-02-13 | Heat-pipe container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56113994A (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125855U (ja) * | 1983-02-14 | 1984-08-24 | 日本無線株式会社 | ガスレ−ザ管 |
| KR100495699B1 (ko) * | 2002-10-16 | 2005-06-16 | 엘에스전선 주식회사 | 판형 열전달장치 및 그 제조방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116647A (OSRAM) * | 1973-03-12 | 1974-11-07 | ||
| JPS6054347B2 (ja) * | 1977-08-08 | 1985-11-29 | 東レ株式会社 | 難燃性樹脂組成物 |
-
1980
- 1980-02-13 JP JP1616880A patent/JPS56113994A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56113994A (en) | 1981-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6816378B1 (en) | Stack up assembly | |
| US5095404A (en) | Arrangement for mounting and cooling high density tab IC chips | |
| US6243269B1 (en) | Centralized cooling interconnect for electronic packages | |
| US20070069369A1 (en) | Heat dissipation device and method for making the same | |
| JPH06169189A (ja) | チップ形発熱部品及びその実装方法 | |
| JP2003188565A (ja) | 表面実装用電子部品の放熱構造 | |
| JP2570861B2 (ja) | インバータ装置 | |
| JPH0156360B2 (OSRAM) | ||
| JP3068488B2 (ja) | プリント基板 | |
| JPH08204072A (ja) | 電子部品の冷却装置 | |
| JPH06268113A (ja) | 電子機器用の放熱部材 | |
| US6518661B1 (en) | Apparatus for metal stack thermal management in semiconductor devices | |
| JPH0342512B2 (OSRAM) | ||
| JP2003152368A (ja) | 電子機器 | |
| JP2002151634A (ja) | 基板放熱装置 | |
| JPS6142864B2 (OSRAM) | ||
| JP2005251916A (ja) | 電子機器筐体の冷却構造 | |
| JP2000315880A (ja) | 回路収納体 | |
| JPS6370447A (ja) | ヒ−トパイプを用いた放熱構造 | |
| JPS5854506B2 (ja) | ホウネツソウチ | |
| WO2019216238A1 (ja) | 回路構成体、及び電気接続箱 | |
| JPH073675Y2 (ja) | 実装電子部品の冷却構造 | |
| JP2538636B2 (ja) | 半導体装置 | |
| JPH0627956Y2 (ja) | 電子回路モジュール | |
| JP2006514429A (ja) | 電子器具用の放熱装置 |