JPH0155609B2 - - Google Patents
Info
- Publication number
- JPH0155609B2 JPH0155609B2 JP18887882A JP18887882A JPH0155609B2 JP H0155609 B2 JPH0155609 B2 JP H0155609B2 JP 18887882 A JP18887882 A JP 18887882A JP 18887882 A JP18887882 A JP 18887882A JP H0155609 B2 JPH0155609 B2 JP H0155609B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- piezoelectric
- shaped
- electrode
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 27
- 230000005284 excitation Effects 0.000 claims description 16
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 18
- 238000000605 extraction Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18887882A JPS5977715A (ja) | 1982-10-26 | 1982-10-26 | チツプ状圧電振動部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18887882A JPS5977715A (ja) | 1982-10-26 | 1982-10-26 | チツプ状圧電振動部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5977715A JPS5977715A (ja) | 1984-05-04 |
| JPH0155609B2 true JPH0155609B2 (US20030199744A1-20031023-C00003.png) | 1989-11-27 |
Family
ID=16231455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18887882A Granted JPS5977715A (ja) | 1982-10-26 | 1982-10-26 | チツプ状圧電振動部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5977715A (US20030199744A1-20031023-C00003.png) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0724810Y2 (ja) * | 1988-08-12 | 1995-06-05 | 株式会社村田製作所 | 圧電共振子 |
| JPH0744418B2 (ja) * | 1988-08-31 | 1995-05-15 | 株式会社村田製作所 | 圧電振動子 |
| JPH0257621U (US20030199744A1-20031023-C00003.png) * | 1988-10-20 | 1990-04-25 | ||
| JPH02116126U (US20030199744A1-20031023-C00003.png) * | 1989-03-02 | 1990-09-18 | ||
| JPH083060Y2 (ja) * | 1989-06-02 | 1996-01-29 | 株式会社村田製作所 | 圧電共振子 |
| JPH083061Y2 (ja) * | 1989-06-02 | 1996-01-29 | 株式会社村田製作所 | 圧電振動子 |
| US5170303A (en) * | 1990-04-30 | 1992-12-08 | Seagate Technology Inc. | Inductive thin film head having improved readback characteristics |
| JPH0412712U (US20030199744A1-20031023-C00003.png) * | 1990-05-23 | 1992-01-31 | ||
| US5237235A (en) * | 1991-09-30 | 1993-08-17 | Motorola, Inc. | Surface acoustic wave device package |
| US5382929A (en) * | 1992-07-31 | 1995-01-17 | Ndk, Nihon Dempa Kogyo Company, Ltd. | Monolithic crystal filter |
| US5729185A (en) * | 1996-04-29 | 1998-03-17 | Motorola Inc. | Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal |
| JP2006148758A (ja) * | 2004-11-24 | 2006-06-08 | Kyocera Kinseki Corp | 水晶振動子パッケージ |
-
1982
- 1982-10-26 JP JP18887882A patent/JPS5977715A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5977715A (ja) | 1984-05-04 |
