JPH0151063B2 - - Google Patents

Info

Publication number
JPH0151063B2
JPH0151063B2 JP58051422A JP5142283A JPH0151063B2 JP H0151063 B2 JPH0151063 B2 JP H0151063B2 JP 58051422 A JP58051422 A JP 58051422A JP 5142283 A JP5142283 A JP 5142283A JP H0151063 B2 JPH0151063 B2 JP H0151063B2
Authority
JP
Japan
Prior art keywords
layer
solder
diffusion
metal element
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58051422A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59177949A (ja
Inventor
Michihiko Inaba
Koichi Tejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP5142283A priority Critical patent/JPS59177949A/ja
Publication of JPS59177949A publication Critical patent/JPS59177949A/ja
Publication of JPH0151063B2 publication Critical patent/JPH0151063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5142283A 1983-03-29 1983-03-29 民生用素子 Granted JPS59177949A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5142283A JPS59177949A (ja) 1983-03-29 1983-03-29 民生用素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5142283A JPS59177949A (ja) 1983-03-29 1983-03-29 民生用素子

Publications (2)

Publication Number Publication Date
JPS59177949A JPS59177949A (ja) 1984-10-08
JPH0151063B2 true JPH0151063B2 (enrdf_load_stackoverflow) 1989-11-01

Family

ID=12886484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5142283A Granted JPS59177949A (ja) 1983-03-29 1983-03-29 民生用素子

Country Status (1)

Country Link
JP (1) JPS59177949A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5310660B2 (ja) 2010-07-01 2013-10-09 富士電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596664A (en) * 1979-01-16 1980-07-23 Furukawa Electric Co Ltd:The Copper alloy for lead frame of semiconductor element

Also Published As

Publication number Publication date
JPS59177949A (ja) 1984-10-08

Similar Documents

Publication Publication Date Title
JP2885773B2 (ja) 半田付け用無鉛合金
JP3736452B2 (ja) はんだ箔
WO1997000753A1 (en) Solder, and soldered electronic component and electronic circuit board
TWI505899B (zh) A bonding method, a bonding structure, and a method for manufacturing the same
JP2009060101A (ja) 電子機器
WO2006075459A1 (ja) はんだペースト、及び電子装置
JPH11350188A (ja) 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品
KR20190132566A (ko) 면 실장 부품의 솔더링 방법 및 면 실장 부품
JP4453612B2 (ja) 無鉛はんだ合金
JP2003112285A (ja) ソルダーペースト
JP2000054189A (ja) Ｓｎ−Ｂｉ系はんだを接合して用いられる電気・電子部品用材料、それを用いた電気・電子部品、電気・電子部品実装基板、それを用いたはんだ接合または実装方法
JPH1093004A (ja) 電子部品およびその製造方法
JPWO2002005609A1 (ja) 導体間の接続構造及び接続方法
JPH0151063B2 (enrdf_load_stackoverflow)
JPH11350190A (ja) 電気・電子部品用材料とその製造方法、その材料を用いた電気・電子部品
JP2797846B2 (ja) 樹脂封止型半導体装置のＣｕ合金製リードフレーム材
JP4071049B2 (ja) 鉛フリー半田ペースト
JP3596445B2 (ja) 半田接合方法ならびに実装構造
JPH11251503A (ja) 電子部品およびその製造方法
WO2001076335A1 (en) Mounting structure of electronic device and method of mounting electronic device
JPS6349380B2 (enrdf_load_stackoverflow)
JP2970568B2 (ja) 複合リードフレームの製造方法
JP2000052027A (ja) 耐高温用金属接合法
JP2582382B2 (ja) はんだ材
JP3142912B2 (ja) はんだ材料