JPH0150120B2 - - Google Patents

Info

Publication number
JPH0150120B2
JPH0150120B2 JP62179285A JP17928587A JPH0150120B2 JP H0150120 B2 JPH0150120 B2 JP H0150120B2 JP 62179285 A JP62179285 A JP 62179285A JP 17928587 A JP17928587 A JP 17928587A JP H0150120 B2 JPH0150120 B2 JP H0150120B2
Authority
JP
Japan
Prior art keywords
temperature
glass
atmosphere
ceramic
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP62179285A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63128791A (ja
Inventor
Oogasutesu Chansu Dadeiru
Buraian Gorando Deuido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS63128791A publication Critical patent/JPS63128791A/ja
Publication of JPH0150120B2 publication Critical patent/JPH0150120B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP62179285A 1986-11-12 1987-07-20 金属導体を有する高密度多層ガラス・セラミツク構造体の製造方法 Granted JPS63128791A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92997586A 1986-11-12 1986-11-12
US929975 1986-11-12

Publications (2)

Publication Number Publication Date
JPS63128791A JPS63128791A (ja) 1988-06-01
JPH0150120B2 true JPH0150120B2 (enExample) 1989-10-27

Family

ID=25458774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62179285A Granted JPS63128791A (ja) 1986-11-12 1987-07-20 金属導体を有する高密度多層ガラス・セラミツク構造体の製造方法

Country Status (2)

Country Link
EP (1) EP0267602A3 (enExample)
JP (1) JPS63128791A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4971738A (en) * 1988-07-18 1990-11-20 International Business Machines Corporation Enhanced removal of carbon from ceramic substrate laminates
FR2643364B1 (fr) * 1989-02-22 1993-08-13 Air Liquide Procede d'elaboration de composants multicouches ceramique-metal et appareil pour sa mise en oeuvre
GB2229572A (en) * 1989-03-14 1990-09-26 Oxley Dev Co Ltd Ceramic multilayer structure
US5682018A (en) * 1991-10-18 1997-10-28 International Business Machines Corporation Interface regions between metal and ceramic in a metal/ceramic substrate
US5716713A (en) * 1994-12-16 1998-02-10 Ceramic Packaging, Inc. Stacked planar transformer
JP4533129B2 (ja) * 2004-12-28 2010-09-01 日本特殊陶業株式会社 配線基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
US4474731A (en) * 1983-03-28 1984-10-02 International Business Machines Corporation Process for the removal of carbon residues during sintering of ceramics
US4671928A (en) * 1984-04-26 1987-06-09 International Business Machines Corporation Method of controlling the sintering of metal particles

Also Published As

Publication number Publication date
EP0267602A3 (en) 1990-08-01
JPS63128791A (ja) 1988-06-01
EP0267602A2 (en) 1988-05-18

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