JPH0144438B2 - - Google Patents

Info

Publication number
JPH0144438B2
JPH0144438B2 JP61092524A JP9252486A JPH0144438B2 JP H0144438 B2 JPH0144438 B2 JP H0144438B2 JP 61092524 A JP61092524 A JP 61092524A JP 9252486 A JP9252486 A JP 9252486A JP H0144438 B2 JPH0144438 B2 JP H0144438B2
Authority
JP
Japan
Prior art keywords
tin
water
solder flux
soldering
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61092524A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62248596A (ja
Inventor
Fumiaki Ogura
Takao Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Original Assignee
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK filed Critical NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority to JP61092524A priority Critical patent/JPS62248596A/ja
Publication of JPS62248596A publication Critical patent/JPS62248596A/ja
Publication of JPH0144438B2 publication Critical patent/JPH0144438B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Detergent Compositions (AREA)
JP61092524A 1986-04-22 1986-04-22 水溶性ハンダフラツクス及びそれを用いたハンダ付け方法 Granted JPS62248596A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61092524A JPS62248596A (ja) 1986-04-22 1986-04-22 水溶性ハンダフラツクス及びそれを用いたハンダ付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61092524A JPS62248596A (ja) 1986-04-22 1986-04-22 水溶性ハンダフラツクス及びそれを用いたハンダ付け方法

Publications (2)

Publication Number Publication Date
JPS62248596A JPS62248596A (ja) 1987-10-29
JPH0144438B2 true JPH0144438B2 (enExample) 1989-09-27

Family

ID=14056729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61092524A Granted JPS62248596A (ja) 1986-04-22 1986-04-22 水溶性ハンダフラツクス及びそれを用いたハンダ付け方法

Country Status (1)

Country Link
JP (1) JPS62248596A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991003355A1 (fr) * 1989-09-05 1991-03-21 Nakajima All Precision Kabushiki Kaisha Flux de brasage abrasif et soluble dans l'eau
CN102161135A (zh) * 2011-03-30 2011-08-24 浙江强力焊锡材料有限公司 一种无铅焊锡丝及其所用水溶性助焊剂

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5069730A (en) * 1991-01-28 1991-12-03 At&T Bell Laboratories Water-soluble soldering paste
JP2909351B2 (ja) * 1993-05-28 1999-06-23 ホシザキ電機株式会社 はんだ付用フラックス
CN101690997B (zh) 2009-10-12 2011-06-15 宁波喜汉锡焊料有限公司 一种无卤免清洗助焊剂
CN102922163B (zh) * 2012-11-01 2015-01-14 青岛英太克锡业科技有限公司 一种无铅铝焊锡丝及其制备方法
JP2017119782A (ja) * 2015-12-28 2017-07-06 花王株式会社 水溶性フラックス用洗浄剤組成物
WO2019175859A1 (en) * 2018-03-15 2019-09-19 Printcb Ltd. Two-component printable conductive composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991003355A1 (fr) * 1989-09-05 1991-03-21 Nakajima All Precision Kabushiki Kaisha Flux de brasage abrasif et soluble dans l'eau
CN102161135A (zh) * 2011-03-30 2011-08-24 浙江强力焊锡材料有限公司 一种无铅焊锡丝及其所用水溶性助焊剂

Also Published As

Publication number Publication date
JPS62248596A (ja) 1987-10-29

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