JPH0143708B2 - - Google Patents

Info

Publication number
JPH0143708B2
JPH0143708B2 JP58110366A JP11036683A JPH0143708B2 JP H0143708 B2 JPH0143708 B2 JP H0143708B2 JP 58110366 A JP58110366 A JP 58110366A JP 11036683 A JP11036683 A JP 11036683A JP H0143708 B2 JPH0143708 B2 JP H0143708B2
Authority
JP
Japan
Prior art keywords
binder
weight
parts
molded
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58110366A
Other languages
English (en)
Japanese (ja)
Other versions
JPS605064A (ja
Inventor
Katsuhiro Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58110366A priority Critical patent/JPS605064A/ja
Publication of JPS605064A publication Critical patent/JPS605064A/ja
Publication of JPH0143708B2 publication Critical patent/JPH0143708B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP58110366A 1983-06-20 1983-06-20 窒化系セラミツクス成形用バインダ Granted JPS605064A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58110366A JPS605064A (ja) 1983-06-20 1983-06-20 窒化系セラミツクス成形用バインダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58110366A JPS605064A (ja) 1983-06-20 1983-06-20 窒化系セラミツクス成形用バインダ

Publications (2)

Publication Number Publication Date
JPS605064A JPS605064A (ja) 1985-01-11
JPH0143708B2 true JPH0143708B2 (cs) 1989-09-22

Family

ID=14533968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58110366A Granted JPS605064A (ja) 1983-06-20 1983-06-20 窒化系セラミツクス成形用バインダ

Country Status (1)

Country Link
JP (1) JPS605064A (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5648665A (en) * 1994-04-28 1997-07-15 Ngk Insulators, Ltd. Semiconductor device having a plurality of cavity defined gating regions and a fabrication method therefor
JP3245308B2 (ja) * 1994-08-26 2002-01-15 日本碍子株式会社 半導体装置の製造方法
JP3214987B2 (ja) * 1994-09-05 2001-10-02 日本碍子株式会社 半導体装置およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941949B2 (ja) * 1979-02-27 1984-10-11 旭硝子株式会社 セラミックス粉末の成形方法

Also Published As

Publication number Publication date
JPS605064A (ja) 1985-01-11

Similar Documents

Publication Publication Date Title
CA2279966C (en) Gel strength enhancing additives for agaroid-based injection molding compositions
JP2843348B2 (ja) 複雑な高性能セラミック及び金属付形物の形成
JPH02302357A (ja) セラミックス射出成形材料及びこれを用いた射出成形方法
DE69007391T2 (de) Verfahren zum Spritzgiessen von keramischen Werkstoffen.
JPH01245941A (ja) 鋳造中子の製造方法
JPH0143708B2 (cs)
CN113878113A (zh) 一种陶瓷-不锈钢复合材料及其制备方法
US3238049A (en) Dry grinding of ceramics
JPH0134948B2 (cs)
JPS5919903B2 (ja) ＳｉＣ系焼結体のホツトプレス製造方法
JPS6048468B2 (ja) 低焼成収縮、高寸法精度の陶磁器製造法
JPS61101465A (ja) 秩化珪素結合炭化珪素焼結体の製造方法
JPS63277576A (ja) 高寸法精度セラミックスの製造法及び組成物
JPH0483752A (ja) 焼結性物質混合物
JP3479718B2 (ja) 金属又はセラミックからなる造形品の製造方法
JPS616172A (ja) 射出成形用セラミツクス組成物
JPS59223266A (ja) 非酸化物セラミツクス焼結体の製造方法
JPS6321250A (ja) セラミツク射出成形組成物製造方法
JPS61151059A (ja) セラミツク粉末の成形方法
JPH0421626B2 (cs)
JPS62191458A (ja) セラミツクス成形体の製造方法
JPS61201662A (ja) 複合セラミツクスの製造法
JPH0570803A (ja) 射出成形用組成物並びにこれを用いた炭化物分散焼結品の製造方法
JPS61263703A (ja) 粉末の射出成形方法
JPH0848568A (ja) セラミック焼結体の製造方法