JPH0143479B2 - - Google Patents

Info

Publication number
JPH0143479B2
JPH0143479B2 JP60141948A JP14194885A JPH0143479B2 JP H0143479 B2 JPH0143479 B2 JP H0143479B2 JP 60141948 A JP60141948 A JP 60141948A JP 14194885 A JP14194885 A JP 14194885A JP H0143479 B2 JPH0143479 B2 JP H0143479B2
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
laminated
board
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60141948A
Other languages
English (en)
Japanese (ja)
Other versions
JPS622695A (ja
Inventor
Kiichi Tamaya
Takashi Okazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Print Industry Co Ltd
Original Assignee
Tokyo Print Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Print Industry Co Ltd filed Critical Tokyo Print Industry Co Ltd
Priority to JP14194885A priority Critical patent/JPS622695A/ja
Publication of JPS622695A publication Critical patent/JPS622695A/ja
Publication of JPH0143479B2 publication Critical patent/JPH0143479B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP14194885A 1985-06-28 1985-06-28 プリント配線板の製造方法 Granted JPS622695A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14194885A JPS622695A (ja) 1985-06-28 1985-06-28 プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14194885A JPS622695A (ja) 1985-06-28 1985-06-28 プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS622695A JPS622695A (ja) 1987-01-08
JPH0143479B2 true JPH0143479B2 (cs) 1989-09-20

Family

ID=15303857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14194885A Granted JPS622695A (ja) 1985-06-28 1985-06-28 プリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS622695A (cs)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012793A (ja) * 1983-07-01 1985-01-23 株式会社東芝 セラミツク多層配線基板の製造方法

Also Published As

Publication number Publication date
JPS622695A (ja) 1987-01-08

Similar Documents

Publication Publication Date Title
HU216987B (hu) Alkotóelem nyomtatott áramköri lapokhoz
JPH0878273A (ja) 積層型電子部品の製造方法
JPH0143479B2 (cs)
CN112243319B (zh) 柔性电路板的制作方法及柔性电路板
JPH059956B2 (cs)
JPH08307053A (ja) 金属コアプリント配線板の製造方法
JPH0321095A (ja) 大電流回路基板の製造方法
JP4042693B2 (ja) 回路基板の製造装置およびそれを用いた回路基板の製造方法
US8997343B2 (en) Method for manufacturing multilayer printed circuit board
GB2249219A (en) Manufacturing single sided printed wiring boards
JP2004146624A (ja) 内層回路入り金属箔張り積層板の製造法
JPS622694A (ja) プリント配線板の製造方法
JP2749685B2 (ja) 回路基板の製造方法
JPS5843242Y2 (ja) プリント配線板
CN217088243U (zh) 一种镍磷方阻材料混压的多层盲孔微波板
JPH0365676B2 (cs)
JP2000133943A (ja) 多層基板の製造方法
JPH0471285A (ja) メタルコアプリント配線板の外形加工方法
JPS6174792A (ja) 複合部品の製造方法
JPH10126058A (ja) 多層プリント配線板の製造方法
JPH02241089A (ja) 銅板内蔵多層プリント基板の製造方法
JPH0964535A (ja) プリント配線板の製造方法
JP3610591B2 (ja) 多層印刷配線板の製造方法
JP2005101045A (ja) 回路基板とその製造方法
JPH01124284A (ja) プリント基板の製造方法