JPH0143238Y2 - - Google Patents
Info
- Publication number
- JPH0143238Y2 JPH0143238Y2 JP1983071619U JP7161983U JPH0143238Y2 JP H0143238 Y2 JPH0143238 Y2 JP H0143238Y2 JP 1983071619 U JP1983071619 U JP 1983071619U JP 7161983 U JP7161983 U JP 7161983U JP H0143238 Y2 JPH0143238 Y2 JP H0143238Y2
- Authority
- JP
- Japan
- Prior art keywords
- current
- substrate
- support
- heat
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electronic Switches (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983071619U JPS59176555U (ja) | 1983-05-13 | 1983-05-13 | サ−マルヘツド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983071619U JPS59176555U (ja) | 1983-05-13 | 1983-05-13 | サ−マルヘツド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59176555U JPS59176555U (ja) | 1984-11-26 |
JPH0143238Y2 true JPH0143238Y2 (enrdf_load_html_response) | 1989-12-15 |
Family
ID=30201765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983071619U Granted JPS59176555U (ja) | 1983-05-13 | 1983-05-13 | サ−マルヘツド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59176555U (enrdf_load_html_response) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63221055A (ja) * | 1987-03-10 | 1988-09-14 | Rohm Co Ltd | ライン型サ−マルヘツド |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6055028B2 (ja) * | 1977-11-09 | 1985-12-03 | キヤノン株式会社 | 表面電位計 |
JPS5722937U (enrdf_load_html_response) * | 1980-07-14 | 1982-02-05 | ||
JPS57116665A (en) * | 1981-01-14 | 1982-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head incorporated in driving circuit |
JPS5814779A (ja) * | 1981-07-20 | 1983-01-27 | Matsushita Electric Ind Co Ltd | 感熱記録用サ−マルヘツド |
JPS5867473A (ja) * | 1981-10-19 | 1983-04-22 | Oki Electric Ind Co Ltd | サ−マルヘツド |
-
1983
- 1983-05-13 JP JP1983071619U patent/JPS59176555U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59176555U (ja) | 1984-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3461829B2 (ja) | 緩衝層を有する電力半導体素子 | |
JPH03153063A (ja) | カプセル封止した半導体パツケージ | |
JPS6370498A (ja) | セラミック基板と熱放散器の組合せ | |
US20070007280A1 (en) | Method for producing a circuit module | |
JPS63106910A (ja) | 薄膜磁気ヘツド | |
JPH05500733A (ja) | 印刷配線板複合構造体 | |
JPH0143238Y2 (enrdf_load_html_response) | ||
JP2717867B2 (ja) | ボンディングツール | |
CA1235528A (en) | Heat dissipation for electronic components on ceramic substrate | |
JPS59175798A (ja) | 可撓性プリント回路基板,プリント基板の改良方法および改良されたプリント基板 | |
JPS60247992A (ja) | 集積回路チツプ実装基板 | |
JPS5814779A (ja) | 感熱記録用サ−マルヘツド | |
JP2503779B2 (ja) | 半導体装置用基板 | |
JP2503776B2 (ja) | 半導体装置用基板 | |
JPS6035501A (ja) | リ−ド線付き電子回路素子およびその製造方法 | |
JPH02100346A (ja) | 半導体装置用基板 | |
JPS6315430A (ja) | 半導体装置の製造方法 | |
JPH022024A (ja) | サーマルヘッド | |
JPS61103672A (ja) | 接着構造 | |
JPH0744190B2 (ja) | パワ−ic装置の製造方法 | |
JPS62147736A (ja) | 半導体素子の搭載方法 | |
JPS5935497A (ja) | 銅張り積層板 | |
JPH02160560A (ja) | 感熱ヘツド | |
JPS60140751A (ja) | 厚膜混成集積回路用ボンデイング片 | |
JPS60165745A (ja) | 樹脂封止型半導体装置 |