JPH0143238Y2 - - Google Patents
Info
- Publication number
- JPH0143238Y2 JPH0143238Y2 JP1983071619U JP7161983U JPH0143238Y2 JP H0143238 Y2 JPH0143238 Y2 JP H0143238Y2 JP 1983071619 U JP1983071619 U JP 1983071619U JP 7161983 U JP7161983 U JP 7161983U JP H0143238 Y2 JPH0143238 Y2 JP H0143238Y2
- Authority
- JP
- Japan
- Prior art keywords
- current
- substrate
- support
- heat
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 40
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
【考案の詳細な説明】 考案の背景 技術分野 本考案は、サーマルヘツドに関する。[Detailed explanation of the idea] Background of the idea Technical field The present invention relates to a thermal head.
先行技術とその問題点
サーマルヘツドは、複数の発熱体と、これらの
それぞれに選択的に通電するための通電部とを有
する。Prior Art and its Problems A thermal head has a plurality of heating elements and a current-carrying section for selectively energizing each of them.
これら発熱体および通電部は、同一基板上に形
成することもできるが、大面積にわたつて高密度
配線を形成するため、製造歩留りが低くなり、ま
た、発熱体と通電部とは製造工程が異なるにもか
かわらず一体化するので、一工程あたりの装置効
率が悪く、コスト高となるので、好ましくない。 These heating elements and current-carrying parts can be formed on the same substrate, but since high-density wiring is formed over a large area, the manufacturing yield will be low. Since they are integrated even though they are different, the efficiency of the equipment per process is poor and the cost is high, which is not preferable.
これに対し、発熱体と通電部とを別基板に形成
し、これらを別の支持体上に接着し、互いに電気
的に接続してなるサーマルヘツドがある。 On the other hand, there is a thermal head in which a heating element and a current-carrying part are formed on separate substrates, adhered to separate supports, and electrically connected to each other.
しかし、支持体はヒートシンクをかねさせるた
めに通常、金属製であり、また、絶縁性の基板は
通常、セラミクス製であるため、基板と支持体と
は熱膨張係数が異なる。このため通電時に発生す
る熱により電気的接続部に機械的なストレスが加
わり、特に電気的接続がワイヤボンデイングによ
り行なわれている場合、断線などの事故が発生
し、信頼性が低い。また、特に、支持体として熱
膨張係数の大きいアルミを用いるときには、この
ような現象は顕著となり、他の重い材質を用いな
ければならず、ヘツドの軽量化をはかれない。 However, since the support body is usually made of metal to serve as a heat sink, and the insulating substrate is usually made of ceramics, the substrate and the support body have different coefficients of thermal expansion. For this reason, mechanical stress is applied to the electrical connections due to the heat generated during energization, and especially when the electrical connections are made by wire bonding, accidents such as disconnection occur, resulting in low reliability. In addition, this phenomenon becomes particularly noticeable when aluminum, which has a large coefficient of thermal expansion, is used as the support, and other heavy materials must be used, making it impossible to reduce the weight of the head.
考案の目的
本考案は、このような実状に鑑みなされたもの
であつて、その主たる目的は、熱ストレスに対し
て信頼性が高く、熱膨張係数が大きく軽量なアル
ミ等の金属材質を支持体として用いることがで
き、しかも、製造歩留りと生産性とが高いサーマ
ルヘツドを提供することにある。 Purpose of the invention The present invention was devised in view of the above-mentioned circumstances, and its main purpose is to use a metal material such as aluminum as a support, which is highly reliable against heat stress, has a large coefficient of thermal expansion, and is lightweight. The object of the present invention is to provide a thermal head that can be used as a thermal head and has high manufacturing yield and productivity.
このような目的は、下記の本考案によつて達成
される。 These objects are achieved by the present invention described below.
すなわち本考案は、
一対のリード体を接続した複数の発熱体からな
る発熱部と、各発熱体に選択的に通電するための
通電部とからなる回路を有し、この回路が複数の
基板上に分割されて形成されており、各基板は熱
膨張係数の異なる支持体上に接着され、基板間に
分割されて形成された回路が互いに電気的に接続
されているサーマルヘツドにおいて、
通電部と発熱部とが分割されて別の基板上に形
成され、発熱部と通電部とはワイヤボンデイング
により電気的に接続されており、
支持体が金属製であり、発熱部を有する基板お
よび通電部を有する基板の少なくとも一方がセラ
ミクス製であり、
通電部を有する基板が、発熱部との電気的接続
部端面から全長の2/3以下の長さの範囲において
支持体に部分的に接着されていることを特徴とす
るサーマルヘツドである。 In other words, the present invention has a circuit consisting of a heat generating section consisting of a plurality of heat generating elements connected to a pair of lead bodies, and a current carrying section for selectively energizing each heat generating element, and this circuit is connected to a plurality of substrates. Each substrate is bonded to a support with a different coefficient of thermal expansion, and the circuits formed between the substrates are electrically connected to each other. The heat generating part is separated and formed on a separate substrate, the heat generating part and the current carrying part are electrically connected by wire bonding, and the support body is made of metal, and the substrate having the heat generating part and the current carrying part are connected electrically by wire bonding. At least one of the substrates having the current-carrying part is made of ceramics, and the substrate having the current-carrying part is partially adhered to the support within a range of 2/3 or less of the total length from the end surface of the electrical connection part with the heat-generating part. This thermal head is characterized by:
考案の具体的構成
以下、本考案の具体的構成について詳細に説明
する。 Specific Structure of the Invention Hereinafter, the specific structure of the invention will be explained in detail.
本考案のサーマルヘツドは、公知のサーマルヘ
ツドと同様、一対のリード体を接続した発熱体か
らなる発熱部と、各発熱体に選択的に通電するた
めの通電部とからなる回路をもつ。通電部は、通
常、クロスオーバー配線部と、ドライブ用のダイ
オードないしICとを有する。 The thermal head of the present invention, like the known thermal head, has a circuit consisting of a heat generating section consisting of a heat generating element connected to a pair of leads, and an energizing section for selectively energizing each heat generating element. The current-carrying section usually includes a crossover wiring section and a drive diode or IC.
このような回路は、複数の基板上に分割されて
形成される。基板は、通常、アルミナ等の絶縁性
のセラミクス材料を用いる。 Such a circuit is divided and formed on a plurality of substrates. The substrate is usually made of an insulating ceramic material such as alumina.
本発明では、複数の基板に分割するに際して通
電部と発熱部とを分割して、別の基板上に形成す
る。なお、本考案では、通電部を有する基板およ
び発熱部を有する基板の少なくとも一方がセラミ
クス材料から構成される。 In the present invention, when dividing into a plurality of substrates, the current-carrying portion and the heat-generating portion are separated and formed on separate substrates. Note that in the present invention, at least one of the substrate having the current-carrying part and the substrate having the heat-generating part is made of a ceramic material.
そして、通常、発熱部は薄膜法により、また通
電部は厚膜法により形成される。 Usually, the heat generating part is formed by a thin film method, and the current carrying part is formed by a thick film method.
なお、上記のような場合、通電部のクロスオー
バー配線部と、ダイオードないしICとは、一体
基板上に形成しても、別基板上に形成してもよ
い。 Note that in the above case, the crossover wiring part of the current-carrying part and the diode or IC may be formed on an integrated substrate or on separate substrates.
このような各基板は、支持体上に配列されて接
着される。 Each of these substrates is arranged and bonded onto a support.
用いる支持体は、熱サイクルにおけるヒートシ
ンクをかねさせるため、熱伝導度が高く、また平
担性の良好なものがよい。このため、本考案で
は、支持体は金属製とされる。従つて、支持体の
熱膨張係数は、各基板のそれよりも大きいもので
ある。 The support to be used should have high thermal conductivity and good flatness since it also serves as a heat sink during thermal cycles. Therefore, in the present invention, the support is made of metal. Therefore, the coefficient of thermal expansion of the support is larger than that of each substrate.
なお、金属のうちでは、価格の点で、鉄、アル
ミ、銅、あるいはこれらを含む合金が好ましく、
このうち、特に、ヘツド重量を軽量化する点で、
アルミないしアルミ合金が好ましい。そして、こ
のような熱膨張係数の大きな材質でも、本考案に
従い、熱ストレスに対する十分な信頼性がえられ
るものである。 In addition, among metals, iron, aluminum, copper, or alloys containing these are preferable from the point of view of price.
Among these, in particular, in terms of reducing the weight of the head,
Aluminum or aluminum alloy is preferred. Even with such a material having a large coefficient of thermal expansion, sufficient reliability against thermal stress can be obtained according to the present invention.
さらに、基板間に分割されて形成された回路
は、互いに電気的に接続される。本考案では、接
続はワイヤボンデイングによつて行われる。 Furthermore, the circuits formed by being divided between the substrates are electrically connected to each other. In the present invention, the connection is made by wire bonding.
なお、第１図には、支持体４上に、発熱部１と
通電部２を別の基板３１，３２上に形成したもの
を接着剤６１，６２によつて接着し、これらをワ
イヤボンデイング５によつて電気的に接続した例
が示される。 In addition, in FIG. 1, the heat-generating part 1 and the current-carrying part 2 formed on separate substrates 31 and 32 are bonded to the support 4 with adhesives 61 and 62, and these are bonded by wire bonding 5. An example of electrical connection is shown.
このような前提において、本考案においては、
通電部を有する基板が支持体に部分的に接着され
る。 Based on this premise, in this invention,
A substrate having a current carrying part is partially adhered to the support.
部分的に接着することにより、支持体と基板と
の熱膨張率の相違にもとづく熱ストレスは、格段
と小さくなる。 By partially adhering, thermal stress due to the difference in coefficient of thermal expansion between the support and the substrate is significantly reduced.
本考案では、通電部を有する基板の底面は、発
熱部との電気的接続部に近い側、すなわちワイヤ
ボンデイングされている側のみが支持体表面に部
分的に接着されるため、支持体と基板との熱膨張
率の相違にもとづく熱ストレスはワイヤボンデイ
ング側では極めて小さく、従つて、ワイヤボンデ
イングの断線発生数は極めて少ない。 In the present invention, only the bottom surface of the substrate having the current-carrying part is partially bonded to the support surface on the side closer to the electrical connection with the heat generating part, that is, the side where wire bonding is performed, so that the support and the substrate are bonded to each other. Thermal stress due to the difference in coefficient of thermal expansion between the two wires is extremely small on the wire bonding side, and therefore the number of disconnections in the wire bonding is extremely small.
そして、部分的に接着する基板（第１図におい
て通電部２を有する基板３２）の電気的接続部側
端面から他端面までの全長をｂとしたとき、基板
３２は、電気的接続部側端面から2/3ｂ以下の長
さａの範囲にて、支持体４に部分的に接着される
ように構成されるため、上記の効果はより一層高
いものとなる。 Then, when the total length from the electrical connection part side end face to the other end face of the board to be partially bonded (the board 32 having the current carrying part 2 in FIG. 1) is defined as b, the board 32 has the electrical connection part side end face. Since it is configured to be partially adhered to the support body 4 within the range of the length a from 2/3b or less, the above effect is further enhanced.
この場合、ａは、1/2ｂ〜1/3ｂであると特に好
ましい。 In this case, a is particularly preferably 1/2b to 1/3b.
一方、部分的に接着する基板の前記全長ｂは、
10mm以上、特に10〜40mmであることが好ましい。
このとき、上記のように部分的に接着しても、十
分な接着強度がえられるからである。 On the other hand, the total length b of the partially bonded substrate is
It is preferably 10 mm or more, particularly 10 to 40 mm.
At this time, sufficient adhesive strength can be obtained even if the adhesive is partially adhered as described above.
考案の具体的作用効果
本考案のサーマルヘツドは、発熱部に感熱紙や
熱転写リボンをしゆう動させつつ、通電部から各
発熱体層に選択的にパルス通電を行い使用され
る。 Specific Effects of the Invention The thermal head of the present invention is used by selectively applying pulse current to each heating element layer from the current-carrying part while moving thermal paper or thermal transfer ribbon around the heating part.
このような熱サイクルにおいて、本考案によれ
ば、基板の下面全域を支持体に接着する場合と比
較して、ワイヤボンデイングによる電気的接続を
行う基板間の間〓の温度変化にともなう変化率が
格段に小さくなるので、ワイヤボンデイング部に
加わる機械的ストレスが格段と小さくなり、断線
の発生がきわめて小さくなる。 In such a thermal cycle, according to the present invention, the rate of change due to temperature change between the substrates where electrical connection is made by wire bonding is reduced, compared to the case where the entire bottom surface of the substrate is bonded to the support. Since it is much smaller, the mechanical stress applied to the wire bonding part is much smaller, and the occurrence of wire breakage is extremely reduced.
この場合、第１図の側において、クロスオーバ
ー配線部の基板３２の全長ｂ＝30mm、接着長さａ
＝10mm、基板３１，３２間間〓ｃ＝0.2mm、発熱
部１の基板３１の全長20mmとし、基板３１，３２
を１mm厚のアルミナ製、支持体４を５mm厚のアル
ミ製としたときと、上記においてｂ＝ａとして、
基板３２を全面接着したときとを比較すると、支
持体温度の変化に対する上記ｃの変化率は60％に
減少した。 In this case, on the side shown in FIG.
= 10 mm, distance between boards 31 and 32 = c = 0.2 mm, total length of board 31 of heat generating part 1 is 20 mm, and between boards 31 and 32
When is made of 1 mm thick alumina and the support 4 is made of 5 mm thick aluminum, and in the above, b = a,
When compared with the case where the entire surface of the substrate 32 was bonded, the rate of change in c with respect to change in support temperature was reduced to 60%.
すなわち、本考案によれば、熱ストレスに対す
る信頼性が格段と向上するものである。 That is, according to the present invention, reliability against thermal stress is significantly improved.
また、アルミのような熱膨張係数のきわめて大
きい材質を支持体として用いることができ、ヘツ
ドの軽量化がはかれる。 Furthermore, a material with an extremely large coefficient of thermal expansion, such as aluminum, can be used as the support, and the weight of the head can be reduced.
そして、一体の基板上に回路を形成するもので
はないので、製造歩留りと生産性がきわめて高く
なる。 Furthermore, since the circuit is not formed on a single substrate, manufacturing yield and productivity are extremely high.
第１図は、本考案の実施例を示す一部省略正面
図である。
１……発熱部、２……通電部、３１，３２……
基板、４……支持体、５……ワイヤボンデイン
グ、６１，６２……接着剤。
FIG. 1 is a partially omitted front view showing an embodiment of the present invention. 1... Heat generating part, 2... Current carrying part, 31, 32...
Substrate, 4... Support, 5... Wire bonding, 61, 62... Adhesive.
Claims (1)
なる発熱部と、各発熱体に選択的に通電するた
めの通電部とからなる回路を有し、この回路が
複数の基板上に分割されて形成されており、各
基板は熱膨張係数の異なる支持体上に接着さ
れ、基板間に分割されて形成された回路が互い
に電気的に接続されているサーマルヘツドにお
いて、 通電部と発熱部とが分割されて別の基板上に
形成され、発熱部と通電部とはワイヤボンデイ
ングにより電気的に接続されており、 支持体が金属製であり、発熱部を有する基板
および通電部を有する基板の少なくとも一方が
セラミクス製であり、 通電部を有する基板が、発熱部との電気的接
続部端面から全長の2/3以下の長さの範囲にお
いて支持体に部分的に接着されていることを特
徴とするサーマルヘツド。 ２ 電気的接続部側端面から、全長の1/3〜1/2の
長さの範囲が、部分的に接着されている実用新
案登録請求の範囲第１項に記載のサーマルヘツ
ド。 ３ 基板の電気的接続部端から他端までの全長が
10mm以上である実用新案登録請求の範囲第１項
または第２項に記載のサーマルヘツド。[Claims for Utility Model Registration] 1. A circuit consisting of a heating section consisting of a plurality of heating elements connected to a pair of lead bodies, and a current-carrying section for selectively energizing each heating element. A thermal head is formed by being divided into multiple substrates, each substrate is adhered to a support with a different coefficient of thermal expansion, and the circuits formed by being divided between the substrates are electrically connected to each other. , the current-carrying part and the heat-generating part are separated and formed on separate substrates, the heat-generating part and the current-carrying part are electrically connected by wire bonding, the support is made of metal, and the substrate has the heat-generating part. and at least one of the substrates having the current-carrying part is made of ceramics, and the substrate having the current-carrying part is partially attached to the support in a range of 2/3 or less of the total length from the end surface of the electrical connection part with the heat-generating part. A thermal head characterized by being glued. 2. The thermal head according to claim 1 of the utility model registration, wherein a range of 1/3 to 1/2 of the total length from the end surface of the electrical connection part is partially bonded. 3 The total length from one end of the electrical connection part of the board to the other end is
The thermal head according to claim 1 or 2 of the utility model registration claim, which has a diameter of 10 mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7161983U JPS59176555U (en) | 1983-05-13 | 1983-05-13 | thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7161983U JPS59176555U (en) | 1983-05-13 | 1983-05-13 | thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59176555U JPS59176555U (en) | 1984-11-26 |
| JPH0143238Y2 true JPH0143238Y2 (en) | 1989-12-15 |
Family
ID=30201765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7161983U Granted JPS59176555U (en) | 1983-05-13 | 1983-05-13 | thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59176555U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63221055A (en) * | 1987-03-10 | 1988-09-14 | Rohm Co Ltd | Line type thermal head |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5467473A (en) * | 1977-11-09 | 1979-05-30 | Canon Inc | Surface potentiometer |
| JPS5722937B2 (en) * | 1974-03-18 | 1982-05-15 | ||
| JPS57116665A (en) * | 1981-01-14 | 1982-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head incorporated in driving circuit |
| JPS5814779A (en) * | 1981-07-20 | 1983-01-27 | Matsushita Electric Ind Co Ltd | Thermal head for heat-sensitive recording |
| JPS5867473A (en) * | 1981-10-19 | 1983-04-22 | Oki Electric Ind Co Ltd | Thermal head |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722937U (en) * | 1980-07-14 | 1982-02-05 |
-
1983
- 1983-05-13 JP JP7161983U patent/JPS59176555U/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722937B2 (en) * | 1974-03-18 | 1982-05-15 | ||
| JPS5467473A (en) * | 1977-11-09 | 1979-05-30 | Canon Inc | Surface potentiometer |
| JPS57116665A (en) * | 1981-01-14 | 1982-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head incorporated in driving circuit |
| JPS5814779A (en) * | 1981-07-20 | 1983-01-27 | Matsushita Electric Ind Co Ltd | Thermal head for heat-sensitive recording |
| JPS5867473A (en) * | 1981-10-19 | 1983-04-22 | Oki Electric Ind Co Ltd | Thermal head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59176555U (en) | 1984-11-26 |
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