JPS59176555U - thermal head - Google Patents

thermal head

Info

Publication number
JPS59176555U
JPS59176555U JP7161983U JP7161983U JPS59176555U JP S59176555 U JPS59176555 U JP S59176555U JP 7161983 U JP7161983 U JP 7161983U JP 7161983 U JP7161983 U JP 7161983U JP S59176555 U JPS59176555 U JP S59176555U
Authority
JP
Japan
Prior art keywords
thermal head
utility
model registration
electrical connection
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7161983U
Other languages
Japanese (ja)
Other versions
JPH0143238Y2 (en
Inventor
和美 石川
Original Assignee
ティーディーケイ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ティーディーケイ株式会社 filed Critical ティーディーケイ株式会社
Priority to JP7161983U priority Critical patent/JPS59176555U/en
Publication of JPS59176555U publication Critical patent/JPS59176555U/en
Application granted granted Critical
Publication of JPH0143238Y2 publication Critical patent/JPH0143238Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electronic Switches (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の実施例を示す一部省略正面図である
。 １・・・発熱部、２・・・通電部、３１．３２・・・基
板、４・・・支持体、５・・・ワイヤボンディング、６
１゜６２・・・接着剤。FIG. 1 is a partially omitted front view showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Heat generating part, 2... Current carrying part, 31.32... Substrate, 4... Support body, 5... Wire bonding, 6
1゜62...Adhesive.

Claims (1)

【実用新案登録請求の範囲】 １一対のリード体を接続した複数の発熱体からなる発熱
部と、各発熱体に選択的に通電するための通電部とから
なる回路を有し、この回路が複数の基板上に分割されて
形成されており、各基板は熱膨張係数の異なる支持体上
に接着され、基板間に分割されて形成された回路が互い
に電気的に接続されているサーマルヘッドにおいて、少
なくとも１つの木板が、支持体に部分的に接着されてい
ることを特徴とするサーマルヘッド。 ２　支持体が金属製である実用新案登録請求の範囲第１
項に記載のサーマルヘッド。 ３　各基板がセラミックス製である実用新案登録請求の
範囲第１項または第２項に記載のサーマルヘッド。 ４　少なくとも１つの基板が、他の基板との電気的接続
部に近い側のみ、支持体に部分的に接着されている実用
新案登録請求の範囲第１項ないＬ第３項のいずれかに記
載のサーマルヘッド。 ５　電気的接続部側端面から、全長の２７３以下の長さ
の範囲が、部分的に接着されている実用新案登録請求の
範囲第４項に記載のサーマルヘッド。 ６　電気的接続部側端面から、全長の１７３〜１／２の
長さの範囲が、部分的に接着されている実用新案登録請
求の範囲第５項に記載のサーマルヘッド。 ７　基板の電気的接続部端から他端までの全長が１０１
１ｒｌ！を以上である実用新案登録請求の範囲第５項ま
たは第６項に記載のサーマルヘッド。 ８　通電部と発熱部とが分割されて別の基板上に形成さ
れており、通電部を有する基板が発熱部との電気的接続
部に近い側のみ、支持体に部分的に接着されている実用
新案登録請求の範囲第４−項ないし第７項のいずれかに
記載のサーマルヘッド。[Scope of Claim for Utility Model Registration] A circuit comprising a heating section consisting of a plurality of heating elements connected to a pair of lead bodies, and a current-carrying section for selectively energizing each heating element. The thermal head is formed by being divided into multiple substrates, each substrate is adhered to a support with a different coefficient of thermal expansion, and the circuits formed by being divided between the substrates are electrically connected to each other. A thermal head, characterized in that at least one wooden board is partially glued to a support. 2 Claim 1 for utility model registration where the support is made of metal
Thermal head described in section. 3. The thermal head according to claim 1 or 2, wherein each substrate is made of ceramics. 4. Utility model registration according to any of Claims 1 and 3, in which at least one substrate is partially adhered to the support only on the side near the electrical connection with another substrate. thermal head. 5. The thermal head according to claim 4 of the utility model registration, wherein a length range of 273 or less of the total length from the end face of the electrical connection portion is partially bonded. 6. The thermal head according to claim 5, which is a registered utility model, wherein a range of 173 to 1/2 of the total length from the end surface of the electrical connection portion is partially bonded. 7 The total length from the electrical connection end of the board to the other end is 101
1rl! The thermal head according to claim 5 or 6 of the utility model registration claim. 8 The current-carrying part and the heat-generating part are separated and formed on separate substrates, and the substrate having the current-carrying part is partially adhered to the support only on the side near the electrical connection with the heat-generating part. The thermal head according to any one of claims 4-7 of the utility model registration claim.
JP7161983U 1983-05-13 1983-05-13 thermal head Granted JPS59176555U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7161983U JPS59176555U (en) 1983-05-13 1983-05-13 thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7161983U JPS59176555U (en) 1983-05-13 1983-05-13 thermal head

Publications (2)

Publication Number Publication Date
JPS59176555U true JPS59176555U (en) 1984-11-26
JPH0143238Y2 JPH0143238Y2 (en) 1989-12-15

Family

ID=30201765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7161983U Granted JPS59176555U (en) 1983-05-13 1983-05-13 thermal head

Country Status (1)

Country Link
JP (1) JPS59176555U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63221055A (en) * 1987-03-10 1988-09-14 Rohm Co Ltd Line type thermal head

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467473A (en) * 1977-11-09 1979-05-30 Canon Inc Surface potentiometer
JPS5722937U (en) * 1980-07-14 1982-02-05
JPS57116665A (en) * 1981-01-14 1982-07-20 Nippon Telegr & Teleph Corp <Ntt> Thermal head incorporated in driving circuit
JPS5814779A (en) * 1981-07-20 1983-01-27 Matsushita Electric Ind Co Ltd Thermal head for heat-sensitive recording
JPS5867473A (en) * 1981-10-19 1983-04-22 Oki Electric Ind Co Ltd Thermal head

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722937B2 (en) * 1974-03-18 1982-05-15

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467473A (en) * 1977-11-09 1979-05-30 Canon Inc Surface potentiometer
JPS5722937U (en) * 1980-07-14 1982-02-05
JPS57116665A (en) * 1981-01-14 1982-07-20 Nippon Telegr & Teleph Corp <Ntt> Thermal head incorporated in driving circuit
JPS5814779A (en) * 1981-07-20 1983-01-27 Matsushita Electric Ind Co Ltd Thermal head for heat-sensitive recording
JPS5867473A (en) * 1981-10-19 1983-04-22 Oki Electric Ind Co Ltd Thermal head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63221055A (en) * 1987-03-10 1988-09-14 Rohm Co Ltd Line type thermal head

Also Published As

Publication number Publication date
JPH0143238Y2 (en) 1989-12-15

Similar Documents

Publication Publication Date Title
JPS59176555U (en) thermal head
JPS60191346U (en) thermal printing head
JPS6049662U (en) Chip component mounting structure
JPS60106375U (en) Mounting structure of external lead terminal
JPS6143048U (en) Thermal head substrate bonding structure
JPS60119769U (en) flexible circuit board
JPS5971595U (en) sheet heating element
JPS6355997A (en) Electronic unit
JPS602841U (en) semiconductor mounting board
JPS59171372U (en) thin circuit board
JPS60121325U (en) Electronic component drawer structure
JPS6073280U (en) Hybrid integrated circuit device
JPS60121695U (en) Mounting structure of enamel circuit board to heat sink
JPS6096895U (en) Integrated circuit heat dissipation structure
JPS59177224U (en) ultrasonic delay line
JPS58162664U (en) Electronic component assembly structure
JPS60138747U (en) thermal head
JPS5872868U (en) Adhesive structure of flexible printed circuit board
JPS605101U (en) chip resistor
JPS59159975U (en) hybrid integrated circuit board
JPS58189595U (en) board equipment
JPS59191703U (en) chip parts
JPS60113666U (en) Hybrid integrated circuit device
JPS6094861U (en) printed circuit device
JPS5989576U (en) Wiring chip