JPH0142505B2 - - Google Patents

Info

Publication number
JPH0142505B2
JPH0142505B2 JP57081168A JP8116882A JPH0142505B2 JP H0142505 B2 JPH0142505 B2 JP H0142505B2 JP 57081168 A JP57081168 A JP 57081168A JP 8116882 A JP8116882 A JP 8116882A JP H0142505 B2 JPH0142505 B2 JP H0142505B2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
terminals
upper casing
engaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57081168A
Other languages
English (en)
Japanese (ja)
Other versions
JPS581220A (ja
Inventor
Tadashi Tomino
Masayuki Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP57081168A priority Critical patent/JPS581220A/ja
Publication of JPS581220A publication Critical patent/JPS581220A/ja
Publication of JPH0142505B2 publication Critical patent/JPH0142505B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Power Sources (AREA)
  • Calculators And Similar Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57081168A 1982-05-13 1982-05-13 集積回路素子 Granted JPS581220A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57081168A JPS581220A (ja) 1982-05-13 1982-05-13 集積回路素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57081168A JPS581220A (ja) 1982-05-13 1982-05-13 集積回路素子

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2925081A Division JPS57143898A (en) 1981-02-27 1981-02-27 Mounting structure for integrated circuit element

Publications (2)

Publication Number Publication Date
JPS581220A JPS581220A (ja) 1983-01-06
JPH0142505B2 true JPH0142505B2 (cs) 1989-09-13

Family

ID=13738923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57081168A Granted JPS581220A (ja) 1982-05-13 1982-05-13 集積回路素子

Country Status (1)

Country Link
JP (1) JPS581220A (cs)

Also Published As

Publication number Publication date
JPS581220A (ja) 1983-01-06

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