JPH0221657B2 - - Google Patents

Info

Publication number
JPH0221657B2
JPH0221657B2 JP57081169A JP8116982A JPH0221657B2 JP H0221657 B2 JPH0221657 B2 JP H0221657B2 JP 57081169 A JP57081169 A JP 57081169A JP 8116982 A JP8116982 A JP 8116982A JP H0221657 B2 JPH0221657 B2 JP H0221657B2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
package body
terminals
engaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57081169A
Other languages
English (en)
Japanese (ja)
Other versions
JPS581219A (ja
Inventor
Tadashi Tomino
Masayuki Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP57081169A priority Critical patent/JPS581219A/ja
Publication of JPS581219A publication Critical patent/JPS581219A/ja
Publication of JPH0221657B2 publication Critical patent/JPH0221657B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Calculators And Similar Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57081169A 1982-05-13 1982-05-13 集積回路素子 Granted JPS581219A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57081169A JPS581219A (ja) 1982-05-13 1982-05-13 集積回路素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57081169A JPS581219A (ja) 1982-05-13 1982-05-13 集積回路素子

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2925081A Division JPS57143898A (en) 1981-02-27 1981-02-27 Mounting structure for integrated circuit element

Publications (2)

Publication Number Publication Date
JPS581219A JPS581219A (ja) 1983-01-06
JPH0221657B2 true JPH0221657B2 (cs) 1990-05-15

Family

ID=13738951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57081169A Granted JPS581219A (ja) 1982-05-13 1982-05-13 集積回路素子

Country Status (1)

Country Link
JP (1) JPS581219A (cs)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571553U (cs) * 1978-11-09 1980-05-16

Also Published As

Publication number Publication date
JPS581219A (ja) 1983-01-06

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