JPH0142504B2 - - Google Patents

Info

Publication number
JPH0142504B2
JPH0142504B2 JP57040847A JP4084782A JPH0142504B2 JP H0142504 B2 JPH0142504 B2 JP H0142504B2 JP 57040847 A JP57040847 A JP 57040847A JP 4084782 A JP4084782 A JP 4084782A JP H0142504 B2 JPH0142504 B2 JP H0142504B2
Authority
JP
Japan
Prior art keywords
solder
electronic component
rail
guide member
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57040847A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58158992A (ja
Inventor
Yoshio Abe
Joichiro Kageyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP4084782A priority Critical patent/JPS58158992A/ja
Publication of JPS58158992A publication Critical patent/JPS58158992A/ja
Publication of JPH0142504B2 publication Critical patent/JPH0142504B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4084782A 1982-03-17 1982-03-17 半田処理方法 Granted JPS58158992A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4084782A JPS58158992A (ja) 1982-03-17 1982-03-17 半田処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4084782A JPS58158992A (ja) 1982-03-17 1982-03-17 半田処理方法

Publications (2)

Publication Number Publication Date
JPS58158992A JPS58158992A (ja) 1983-09-21
JPH0142504B2 true JPH0142504B2 (enrdf_load_stackoverflow) 1989-09-13

Family

ID=12591971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4084782A Granted JPS58158992A (ja) 1982-03-17 1982-03-17 半田処理方法

Country Status (1)

Country Link
JP (1) JPS58158992A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60105292A (ja) * 1983-11-14 1985-06-10 近藤 権士 Ic用全自動はんだ付け装置
JPS60106663A (ja) * 1983-11-14 1985-06-12 Kenji Kondo Ic用全自動はんだ付け装置
JPS6260248A (ja) * 1985-07-30 1987-03-16 サン、インダストリアル、コ−テイングス、プライベ−ト、リミテツド 電気または電子部品運搬用キャリアおよび該キャリアへ部品を搭載またはアンローディングするための装置
JPH0438528Y2 (enrdf_load_stackoverflow) * 1989-12-06 1992-09-09
JPH05269574A (ja) * 1991-11-19 1993-10-19 Sun Ind Coatings Pte Ltd 半田付け中電気または電子部品を保持するための装置
JP4578558B2 (ja) * 2008-06-12 2010-11-10 パナソニック株式会社 対物レンズアクチュエータの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019666B2 (ja) * 1979-12-25 1985-05-17 株式会社東芝 樹脂封止半導体の半田付装置
JPS577145A (en) * 1980-06-16 1982-01-14 Toshiba Corp Soldering method of terminal for electronic parts
JPS5740848A (en) * 1980-08-25 1982-03-06 Sankusu:Kk Discharge tube

Also Published As

Publication number Publication date
JPS58158992A (ja) 1983-09-21

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