JPH0142504B2 - - Google Patents
Info
- Publication number
- JPH0142504B2 JPH0142504B2 JP57040847A JP4084782A JPH0142504B2 JP H0142504 B2 JPH0142504 B2 JP H0142504B2 JP 57040847 A JP57040847 A JP 57040847A JP 4084782 A JP4084782 A JP 4084782A JP H0142504 B2 JPH0142504 B2 JP H0142504B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic component
- rail
- guide member
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 88
- 238000005476 soldering Methods 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 description 17
- 230000004907 flux Effects 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 238000001816 cooling Methods 0.000 description 8
- 230000035939 shock Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 235000002595 Solanum tuberosum Nutrition 0.000 description 4
- 244000061456 Solanum tuberosum Species 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Molten Solder (AREA)
Description
【発明の詳細な説明】
本発明は電子部品の半田処理装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for soldering electronic components.
従来、たとえば半導体製品の製造過程において
トランジスタ、集積回路（IC）、大規模集積回路
（LSI）の如き電子部品のリード部に予備半田を
施こすような場合、電子部品を半田処理用治具ご
と半田処理ラインに送るキヤリア治具方式が提案
されている。 Conventionally, when preliminary soldering is applied to the leads of electronic components such as transistors, integrated circuits (ICs), and large-scale integrated circuits (LSIs) in the manufacturing process of semiconductor products, electronic components are soldered together with a soldering jig. A carrier jig method has been proposed that sends the solder to the soldering line.
ところが、この従来方式では、たとえばタング
ステンのワイヤで作られたキヤリア治具間に電子
部品を入れ、そのキヤリア治具ごと半田槽に入れ
て半田コートを行うので、電子部品のみならず、
キヤリア治具も半田と接触し、半田の温度が急に
低下してしまう。その結果、電子部品のリード部
の根元部に半田が厚く残つてしまい、いわゆる
“イモ半田”を生じてしまうという欠点がある。
また、電子部品が半田被着不要部分を含めて全体
的に溶融半田と接触するため、電子部品のタブ吊
り部分の切断個所であるピンチオフ部にも半田が
付着し、不良を生じてしまう。さらに、電子部品
の本体も溶融半田と接触することにより、電子部
品内のペレツト温度が非常に高くなり、熱衝撃に
よつて破壊されるおそれが生じるという欠点もあ
る。 However, in this conventional method, electronic components are placed between carrier jigs made of, for example, tungsten wire, and the carrier jigs are placed in a solder bath for solder coating.
The carrier jig also comes into contact with the solder, causing the temperature of the solder to drop suddenly. As a result, a thick layer of solder remains at the base of the lead portion of the electronic component, resulting in the formation of so-called "potato solder."
Furthermore, since the entire electronic component, including the parts that do not need to be soldered, comes into contact with the molten solder, the solder also adheres to the pinch-off portion where the tab hanging portion of the electronic component is cut, resulting in defects. Furthermore, since the main body of the electronic component also comes into contact with the molten solder, the temperature of the pellet within the electronic component becomes extremely high and there is a risk that it will be destroyed by thermal shock.
そのため、従来は半田処理の歩留りが悪く、半
田処理後の電子部品を全数検査する必要があり、
作業効率の低下およびコストの上昇も来たしてい
た。 Therefore, traditionally, the yield of soldering was low, and it was necessary to inspect all electronic components after soldering.
This also resulted in a decrease in work efficiency and an increase in costs.
本発明の目的は、前記従来技術の欠点を解消
し、ピンチオフ部への半田付着や“イモ半田”に
よる不良を防止でき、また特に電子部品への熱衝
撃を大巾に減少させることのできる電子部品の半
田処理装置を提供することにある。 An object of the present invention is to solve the drawbacks of the prior art described above, to prevent defects caused by solder adhesion to pinch-off parts and "potato solder", and to provide an electronic device that can greatly reduce thermal shock to electronic components. The purpose of the present invention is to provide a parts soldering processing device.
この目的を達成するための本発明の要旨は、複
数の半導体製品をレールとガイド部材ではさんで
半田処理を行う半田処理方法であつて、前記レー
ルによつて前記半導体製品の本体下面部を支持
し、前記ガイド部材は前記半導体製品の本体上面
部に半田が被着しないように前記半導体製品本体
上面部及び半導体製品本体上面部近傍の両側面部
に覆うように形成され、前記レール及び前記ガイ
ド部材を半田で浸した状態で半田処理を行う半田
処理方法にある。 The gist of the present invention to achieve this object is a soldering method for soldering a plurality of semiconductor products by sandwiching them between a rail and a guide member, wherein the lower surface of the main body of the semiconductor product is supported by the rail. The guide member is formed to cover the top surface of the semiconductor product body and both side surfaces near the top surface of the semiconductor product body to prevent solder from adhering to the top surface of the semiconductor product body, and the guide member is formed to cover the top surface of the semiconductor product body and both side surfaces near the top surface of the semiconductor product body, and There is a soldering method in which the soldering process is carried out in a state where the solder is soaked in solder.
以下、本発明を図面に示す実施例にしたがつて
詳細に説明する。 Hereinafter, the present invention will be explained in detail according to embodiments shown in the drawings.
第１図は本発明による電子部品の半田処理装置
の一実施例を示す概略的全体斜視図である。 FIG. 1 is a schematic overall perspective view showing an embodiment of an electronic component soldering apparatus according to the present invention.
本実施例の半田処理装置は、電子部品を半田処
理ラインに供給する供給部１０と、電子部品の被
半田処理部分であるリード部にフラツクスを被着
するフラツクス被着部１２と、リード部に半田を
被着する半田被着部１４と、電子部品に被着した
フラツクスを洗浄除去する洗浄部１６と、洗浄媒
体を乾燥する乾燥部１８と、半田処理を終了した
電子部品を回収する回収部２０と、電子部品を前
記供給部１０から各半田処理部１２，１４，１
６，１８を経て前記回収部２０に移動させる移動
機構２２（第４図）と、移動中の電子部品を案内
するガイド機構２４とからなる。 The solder processing apparatus of this embodiment includes a supply section 10 that supplies electronic components to a soldering processing line, a flux application section 12 that applies flux to the lead parts that are the parts to be soldered, and A soldering section 14 for applying solder, a cleaning section 16 for cleaning and removing flux adhering to electronic components, a drying section 18 for drying the cleaning medium, and a recovery section for recovering electronic components after soldering. 20, and the electronic components are transferred from the supply section 10 to each solder processing section 12, 14, 1.
It consists of a moving mechanism 22 (FIG. 4) that moves the electronic components to the collection section 20 via the electronic components 6 and 18, and a guide mechanism 24 that guides the electronic components being moved.
前記供給部１０は複数個の電子部品２６（第４
図）を収納する収納マガジン２８を有し、ガイド
機構２４の上方に設けた移動機構２２の無端コン
ベヤ２３と送りピン２５により該収納マガジン２
８から電子部品２６をガイド機構２４のレール３
０に供給する。 The supply section 10 supplies a plurality of electronic components 26 (a fourth
The storage magazine 28 has a storage magazine 28 that stores the storage magazine 28 (Fig.
8 to the rail 3 of the guide mechanism 24.
Supply to 0.
前記フラツクス被着部１２は電子部品２６の被
半田処理部分であるリード部３２にフラツクスを
被着するためのフラツクス槽３４を有している。
このフラツクス槽３４においては、図示しないポ
ンプでフラツクス液を噴出し、その噴出液をレー
ル３０に沿つて移動中の電子部品２６のリード部
３２に被着することができる。 The flux application section 12 has a flux tank 34 for applying flux to the lead section 32 of the electronic component 26, which is the part to be soldered.
In the flux tank 34, a pump (not shown) jets out a flux liquid, and the jetted liquid can be applied to the lead portion 32 of the electronic component 26 that is moving along the rail 30.
前記半田被着部１４は、フラツクス被着後の電
子部品２６のリード部３２に半田をコーテイング
する半田コート槽３６を有している。本実施例の
半田コート槽３６は噴流式の構造であり、半田は
ヒータ（図示せず）により溶解されてポンプ（図
示せず）で噴流ノズル部３８（第２図）から噴流
として上向きに噴出され、半田コート槽３６上を
レール３０に沿つて移動中の電子部品２６のリー
ド部３２のみコーテイングされる。 The solder application section 14 has a solder coating tank 36 for coating the lead portions 32 of the electronic component 26 with solder after flux application. The solder coating tank 36 of this embodiment has a jet type structure, and the solder is melted by a heater (not shown) and is jetted upward as a jet from a jet nozzle part 38 (Fig. 2) by a pump (not shown). Then, only the lead portion 32 of the electronic component 26 moving along the rail 30 on the solder coating tank 36 is coated.
本実施例では、電子部品２６のリード部３２の
みに半田を被着し、本体部等の半田被着不要部分
には半田が被着されないようにするため、半田被
着部１４におけるレール３０等のガイド機構２４
は特別な構造を有している。 In this embodiment, in order to apply solder only to the lead portion 32 of the electronic component 26 and not to apply solder to parts such as the main body that do not require soldering, the rail 30 etc. in the solder application portion 14 are applied. guide mechanism 24
has a special structure.
すなわち、第２図〜第５図に示すように、半田
被着部１４におけるガイド機構２４は、電子部品
２６の本体下面を両側で支持し、その上を電子部
品２６が移動機構２２の無端コンベヤ２３および
送りピン２５により押されながらピツチ送り式に
摺動してゆく前記レール３０と、電子部品２６の
上側からその本体部の両側縁部を覆うようにして
ガイドするガイド部材４０とからなる。レール３
０は深溝形の断面形状を有し、その両側の支持用
突条部３０Ａで電子部品２６の下面を支持してい
る。また、レール３０は、電子部品２６の本体が
半田の噴流と接触するのを防止するため噴流ノズ
ル部３８の真上の位置において電子部品２６の下
側を覆う板状の半田ストツパー部分３０Ｂを有
し、この半田ストツパー部分３０Ｂは電子部品２
６に半田の熱が伝わることを減少させるようにす
るため電子部品２６の下面から空洞３１の分だけ
十分に離れている。また、レール３０はこのスト
ツパー部分３０Ｂの長さ方向両側に形成された孔
３０Ｃを有する。これらの孔３０Ｃはレール３０
の内側に仮に半田が浸入して来てもその半田を電
子部品の移動につれて半田コート槽３６の中に戻
すためのものである。レール３０の支持用突条部
３０Ａの上端面は摩擦力低減のため丸味をつける
のが好ましい。 That is, as shown in FIGS. 2 to 5, the guide mechanism 24 in the solder application section 14 supports the lower surface of the main body of the electronic component 26 on both sides, and the electronic component 26 is moved on the endless conveyor of the moving mechanism 22. The rail 30 slides in a pitch-feed manner while being pushed by the electronic component 23 and the feed pin 25, and the guide member 40 guides the electronic component 26 from above so as to cover both side edges of the main body. rail 3
0 has a deep groove-shaped cross-sectional shape, and supports the lower surface of the electronic component 26 with supporting protrusions 30A on both sides thereof. The rail 30 also includes a plate-shaped solder stopper portion 30B that covers the lower side of the electronic component 26 at a position directly above the jet nozzle portion 38 to prevent the main body of the electronic component 26 from coming into contact with the solder jet. However, this solder stopper part 30B is
The cavity 31 is sufficiently spaced from the lower surface of the electronic component 26 in order to reduce the transfer of solder heat to the electronic component 26 . Further, the rail 30 has holes 30C formed on both sides in the length direction of the stopper portion 30B. These holes 30C are the rails 30
Even if solder intrudes into the inside of the electronic component, the solder is returned to the solder coating tank 36 as the electronic component is moved. The upper end surface of the supporting protrusion 30A of the rail 30 is preferably rounded to reduce frictional force.
一方、ガイド部材４０も電子部品２６への半田
熱の伝達を減少させるため、電子部品２６の上面
の上方に空洞４１を有し、ガイド部材４０の下端
は電子部品２６の本体の両側縁部と一致した切欠
形状を有し、溶融半田の噴流のレベル４２が第５
図に示すようなレベルに達したとしても、半田は
その粘性と表面張力の作用により、半田が電子部
品２６とガイド部材４０との間の隙間から内側に
浸入することを防止できる。そのため、電子部品
２６とガイド部材４０との間の隙間の寸法ｌは好
ましくは0.5〜0.7mmにするのが良いことが実験か
ら判明している。また、半田は電子部品２６とレ
ール３０の支持用突条部３０Ａとの接触面間から
内側に浸入することもない。 On the other hand, the guide member 40 also has a cavity 41 above the upper surface of the electronic component 26 in order to reduce the transfer of soldering heat to the electronic component 26, and the lower end of the guide member 40 meets both side edges of the main body of the electronic component 26. It has a matching notch shape and the level 42 of the molten solder jet is at the fifth level.
Even if the solder reaches the level shown in the figure, the viscosity and surface tension of the solder prevent the solder from penetrating inward through the gap between the electronic component 26 and the guide member 40. Therefore, it has been found through experiments that the dimension l of the gap between the electronic component 26 and the guide member 40 is preferably 0.5 to 0.7 mm. Further, the solder does not penetrate inside from between the contact surfaces between the electronic component 26 and the supporting protrusion 30A of the rail 30.
したがつて、本実施例では、レール３０および
ガイド部材４０で電子部品２６の半田被着不要部
分（またはその境界部）を覆つたことにより、半
田はその内側には浸入せず、半田被着の必要なリ
ード部３２のみが半田と接触し、所要の半田コー
テイングが行われ、電子部品２６の本体部は半田
と接触しないので、熱衝撃も小さい。特に本実施
例では、レール３０が電子部品２６と単に支持用
突条部３０Ａのみで接触し、大部分を占める半田
ストツパー部３０Ｂと電子部品２６の下面との間
には十分な寸法の空洞３１が形成されているの
で、半田の熱が電子部品２６に伝達されること
は、空洞３１により最少限に減少し、かつこの空
洞３１はレール３０を伝つて電子部品２６の熱が
半田コート槽３６外に放散されることも相まつて
電子部品２６の熱の放散を助長する役割も果た
す。また、ガイド部材４０の側の空洞４１も空洞
３１と同様な役割を果たす。 Therefore, in this embodiment, since the rail 30 and the guide member 40 cover the part of the electronic component 26 that does not require soldering (or the border thereof), the solder does not penetrate into the inside of the electronic component 26, and the solder does not adhere. Only the necessary lead portions 32 come into contact with the solder, and the required solder coating is performed, and the main body of the electronic component 26 does not come into contact with the solder, so thermal shock is also small. In particular, in this embodiment, the rail 30 contacts the electronic component 26 only through the supporting protrusion 30A, and there is a cavity 31 of sufficient size between the solder stopper portion 30B, which occupies most of the part, and the lower surface of the electronic component 26. is formed, the transfer of solder heat to the electronic component 26 is reduced to a minimum by the cavity 31, and the cavity 31 allows the heat of the electronic component 26 to be transferred to the solder coating tank 36 through the rail 30. Together with being dissipated to the outside, it also plays a role in promoting the dissipation of heat from the electronic component 26. Further, the cavity 41 on the side of the guide member 40 also plays the same role as the cavity 31.
前記半田コート槽３６の下流側には、半田コー
テイングにより温度上昇した電子部品２６を冷却
するための冷却フアン４４を持つ冷却部４２が位
置している。冷却フアン４４はレール３０の下方
から電子部品２６に送風して冷却を行う。 A cooling section 42 having a cooling fan 44 for cooling the electronic components 26 whose temperature has increased due to solder coating is located downstream of the solder coating tank 36 . The cooling fan 44 cools the electronic component 26 by blowing air from below the rail 30.
前記洗浄部１６は、冷却部４２で冷却された電
子部品２６に付着しているフラツクス残渣を洗浄
除去するために設けられた洗浄装置４６、および
洗浄後の電子部品２６に付着している洗浄水を高
圧空気の吹付けにより飛散させる水切り装置４８
からなる。洗浄装置４６は、半田コート直後の電
子部品２６にポンプ加圧水を噴射する第１槽およ
び第２槽と、超音波を用いて残りのフラツクス残
渣を除去する第３槽と、新しい洗浄水を用いて最
終洗浄を行う第４槽とからなる４槽構造である
が、勿論これに限定されるものではない。 The cleaning section 16 includes a cleaning device 46 provided for cleaning and removing flux residues adhering to the electronic components 26 cooled by the cooling section 42, and cleaning water adhering to the electronic components 26 after cleaning. Draining device 48 that scatters water by blowing high-pressure air
Consisting of The cleaning device 46 includes a first tank and a second tank that spray pump-pressurized water onto the electronic components 26 immediately after solder coating, a third tank that uses ultrasonic waves to remove remaining flux residue, and a third tank that uses fresh cleaning water. Although this is a four-tank structure consisting of a fourth tank for final cleaning, it is of course not limited to this.
前記乾燥部１８は、水切り終了後にレール３０
に沿つて移動して来た電子部品２６に対して温風
を吹き付けて完全に乾燥させる乾燥炉５０および
その電子部品２６を冷却する冷却フアン５２を有
している。 The drying section 18 is connected to the rail 30 after draining.
It has a drying oven 50 that blows warm air onto the electronic components 26 that have moved along the path to completely dry them, and a cooling fan 52 that cools the electronic components 26.
前記回収部２０は、半田コート、洗浄および乾
燥を終了した電子部品２６を自動的に回収、収納
する収納マガジン５４を有している。 The collecting section 20 has a storage magazine 54 that automatically collects and stores electronic components 26 that have been solder coated, washed, and dried.
次に、本実施例の作用について説明する。供給
部１０の収納マガジン２８に収納された電子部品
２６は、無端コンベヤ２３の下方に垂下した送り
ピン２５で後端面を押されることによつて第４図
に示す如き状態でレール３０上を順次供給部１０
からフラツクス被着部１２に送られ、フラツクス
槽３４内でリード部３２にフラツクスを被着され
た後、レール３０上を半田被着部１４に移送され
る。 Next, the operation of this embodiment will be explained. The electronic components 26 stored in the storage magazine 28 of the supply section 10 are sequentially moved on the rail 30 in the state shown in FIG. Supply section 10
The lead portion 32 is coated with flux in the flux tank 34, and then transferred to the solder bonding portion 14 on the rail 30.
半田被着部１４では、第５図に示すように電子
部品２６はレール３０の両側の支持用突条部３０
Ａで下面両側を支持され、かつ上側両縁をガイド
部材４０で覆われているので、噴流ノズル部３８
からの噴流半田はレール３０の半田ストツパー部
分３０Ｂにより電子部品２６に接触することを阻
止され、また噴流半田のレベル４２が電子部品２
６の本体部よりも高くなつても、半田の表面張力
と粘性により半田が電子部品２６とガイド部材４
０およびレール３０との間から内側に浸入するこ
とを阻止され、リード部３２のみに半田が被着さ
れる。 In the solder attachment part 14, the electronic component 26 is attached to the supporting protrusions 30 on both sides of the rail 30, as shown in FIG.
Since both sides of the lower surface are supported by A, and both upper edges are covered with the guide member 40, the jet nozzle part 38
The solder jet from the electronic component 26 is prevented from contacting the electronic component 26 by the solder stopper portion 30B of the rail 30, and the solder jet level 42 is prevented from contacting the electronic component 26 by the solder stopper portion 30B of the rail 30.
Even if the height is higher than the main body of the electronic component 26 and the guide member 4, the surface tension and viscosity of the solder will cause the solder to stick to the electronic component 26 and the guide member 4.
0 and the rail 30, and the solder is applied only to the lead portion 32.
その後、半田被着された電子部品２６は冷却部
４２を経て洗浄部１６に送られ、洗浄水の噴射と
超音波振動によりフラツクス残渣を除去される。
その際、本実施例の場合には、前記の如く電子部
品２６のリード部３２のみしか半田が被着されて
いないので、洗浄排水中に持ち込まれるフラツク
スの量が大巾に減少し、洗浄水の汚染が非常に少
くなり、洗浄水を節減できる。 Thereafter, the soldered electronic component 26 is sent to the cleaning section 16 via the cooling section 42, and flux residue is removed by jetting cleaning water and ultrasonic vibration.
At this time, in the case of this embodiment, since only the lead portion 32 of the electronic component 26 is coated with solder as described above, the amount of flux carried into the cleaning waste water is greatly reduced, and the cleaning water contamination is significantly reduced, and cleaning water can be saved.
洗浄後の電子部品２６は水切り装置４８で水切
りされた後、乾燥炉５０において温風により乾燥
され、さらに冷却フアン５２で適温まで冷却さ
れ、回収部２０の収納マガジン５４の中に収納さ
れる。これにより、電子部品２６のリード部３２
に対する半田処理は完了する。 After washing, the electronic components 26 are drained by a drainer 48, dried with hot air in a drying oven 50, cooled to an appropriate temperature by a cooling fan 52, and stored in a storage magazine 54 of the recovery unit 20. As a result, the lead portion 32 of the electronic component 26
The soldering process is completed.
このように、本実施例によれば、半田は半田被
着を必要とする部分すなわちリード部３２のみと
接触するだけであり、電子部品２６の端面のピン
チオフ部に半田が付着したり、リード部３２の根
元部にいわゆる“イモ半田”が生じることを防止
できる。したがつて、本実施例の半田被着部１４
においては、半田はリード部３２のみに均一に被
着され、半田被着不要部分である本体部には被着
されない。 As described above, according to this embodiment, the solder only contacts the parts that require solder adhesion, that is, the lead parts 32, and the solder does not adhere to the pinch-off part of the end face of the electronic component 26 or to the lead parts. It is possible to prevent so-called "potato solder" from forming at the base of the wire 32. Therefore, the solder attachment portion 14 of this embodiment
In this case, solder is uniformly applied only to the lead portion 32, and is not applied to the main body portion, which is a portion where solder is not required.
特に、本実施例では、レール３０の半田ストツ
パー部分３０Ｂと電子部品２６の下面との間に十
分に大きい寸法の空洞３１が形成されていること
により、半田の熱が電子部品２６に伝わることが
最少限に抑制され、電子部品２６への熱衝撃は非
常に小さくなる。 In particular, in this embodiment, since the cavity 31 with a sufficiently large size is formed between the solder stopper portion 30B of the rail 30 and the lower surface of the electronic component 26, the heat of the solder is not transmitted to the electronic component 26. Thermal shock to the electronic components 26 is minimized and becomes extremely small.
すなわち、本発明者がフラツクス温度46℃、半
田温度243℃の場合について電子部品２６内のペ
レツト温度の上昇を無端コンベヤ２３の速度を変
えて本発明と従来技術とで比較実験したところ、
第９図〜第１３図に示すような結果が得られた。
まず、従来はコンベヤスピードが760mm／分の場
合にペレツト温度は130℃以上の高温となつた
（第１３図）のに対し、本発明では第９図のよう
に86℃まで上昇したに過ぎず、電子部品２６への
熱衝撃は本発明の方がはるかに低いものであつ
た。また、本発明について無端コンベヤ２３の速
度を1000mm／分、1200mm／分、1400mm／分と徐々
に速くして実験したところ、それぞれ第１０図、
第１１図、第１２図に示すように、コンベヤ速度
が大きくなるにつれてペレツト温度は低くなるこ
とも確認された。 That is, when the present inventor conducted an experiment to compare the increase in pellet temperature within the electronic component 26 between the present invention and the prior art by changing the speed of the endless conveyor 23 in the case where the flux temperature was 46°C and the solder temperature was 243°C.
The results shown in FIGS. 9 to 13 were obtained.
First, in the past, when the conveyor speed was 760 mm/min, the pellet temperature reached a high temperature of 130°C or more (Figure 13), but in the present invention, it only rose to 86°C as shown in Figure 9. The thermal shock to the electronic component 26 was much lower in the present invention. Further, when an experiment was conducted regarding the present invention by gradually increasing the speed of the endless conveyor 23 to 1000 mm/min, 1200 mm/min, and 1400 mm/min, the results were as shown in Fig. 10, respectively.
As shown in FIGS. 11 and 12, it was also confirmed that the pellet temperature decreased as the conveyor speed increased.
第６図は本発明による他の１つの実施例を示す
断面図である。この実施例は、前記実施例におけ
るいわゆるデユアルインライン形の半導体装置で
はなく、いわゆるTO−５形パツケージを有する
トランジスタが被着半田処理用の電子部品２６′
として選ばれている。したがつて、本実施例で
は、レール３０′の長さ方向中心部にリード部３
２′が通過するための溝５６を形成してあるが、
電子部品２６′の本体部は半田と接触せず、リー
ド部３２′のみが半田と接触して半田の被着が行
われる。また、ガイド部材４０′はその長さ方向
全長にわたつては送りピン２５の通過用の溝を形
成されていない。この実施例の場合にも、前記実
施例と同様に良好な半田処理を行い、かつ熱衝撃
を防止することができる。 FIG. 6 is a sectional view showing another embodiment according to the present invention. This embodiment is not the so-called dual-in-line type semiconductor device in the previous embodiment, but a transistor having a so-called TO-5 type package is attached to an electronic component 26' for soldering.
has been selected as. Therefore, in this embodiment, the lead portion 3 is provided at the center in the longitudinal direction of the rail 30'.
A groove 56 is formed for the passage of 2'.
The main body portion of the electronic component 26' does not come into contact with the solder, and only the lead portion 32' comes into contact with the solder, thereby achieving solder adhesion. Further, the guide member 40' is not provided with a groove for passing the feed pin 25 over its entire length. In the case of this embodiment as well, it is possible to perform a good soldering process and prevent thermal shock as in the previous embodiment.
第７図は本発明のさらに他の１つの実施例を示
す断面図である。本実施例では、ガイド部材４
０″の上方から通路５８を経て圧力空気または不
活性ガスたとえば窒素ガスをガイド部材４０″の
内側と電子部品２６との間の空洞４１″に吹き込
むよう構成されている。したがつて、この場合に
は、ガイド部材４０″と電子部品２６との間への
半田の浸入をより確実に防止できる。 FIG. 7 is a sectional view showing still another embodiment of the present invention. In this embodiment, the guide member 4
Pressure air or an inert gas such as nitrogen gas is blown into the cavity 41'' between the inside of the guide member 40'' and the electronic component 26 from above the guide member 40'' through the passage 58. Therefore, in this case In this way, it is possible to more reliably prevent solder from entering between the guide member 40'' and the electronic component 26.
第８図は本発明のさらに他の実施例を示す概略
説明図である。この実施例は、プリント基板６０
のある一部分６０Ａに半田を被着させたくない場
合に、その部分６０Ａをレール３０で覆つてその
部分６０Ａのみには半田を付着させないようにし
た例である。 FIG. 8 is a schematic explanatory diagram showing still another embodiment of the present invention. In this embodiment, the printed circuit board 60
This is an example in which when it is desired not to apply solder to a certain portion 60A, that portion 60A is covered with the rail 30 so that solder is not applied only to that portion 60A.
なお、本発明は前記実施例に限定されるもので
はない。たとえば、本発明はレール３０とガイド
４０を上下方向に曲線状に形成することにより静
止式半田槽にも適用できる。 Note that the present invention is not limited to the above embodiments. For example, the present invention can be applied to a static solder tank by forming the rail 30 and guide 40 in a curved shape in the vertical direction.
以上説明したように、本発明によれば、電子部
品の必要部分のみに良質の半田被着を行うことが
でき、ピンチオフ部への半田被着や“イモ半田”
の如き半田不良を防止し、歩留りの向上を図るこ
とができる上に、電子部品への熱衝撃も著しく軽
減できる。 As explained above, according to the present invention, it is possible to apply high-quality solder only to the necessary parts of electronic components, and it is possible to apply solder to pinch-off parts and to apply "potato solder".
Not only can soldering defects such as those described above be prevented and yields improved, but also thermal shock to electronic components can be significantly reduced.
第１図は本発明による半田処理装置の一実施例
の全体を示す概略的斜視図、第２図は半田被着部
の拡大部分斜視図、第３図はレールの部分平面
図、第４図は電子部品の移動状態を示す略断面
図、第５図はレールおよびガイド部材の横断方向
断面図、第６図は本発明の他の実施例を示す横断
方向断面図、第７図は本発明のさらに他の１つの
実施例を示す横断方向断面図、第８図は本発明の
さらに他の１つの実施例を示す横断方向断面図、
第９図〜第１３図は本発明と従来技術の熱衝撃低
減効果を比較して示す図である。
１０……供給部、１２……フラツクス被着部、
１４……半田被着部、１６……洗浄部、１８……
乾燥部、２０……回収部、２２……移動機構、２
４……ガイド機構、２６，２６′……電子部品、
３０，３０′……レール、３０Ａ……支持用突条
部、３０Ｂ……半田ストツパー部、３１，３１′
……空洞、３２，３２′……リード部、４０，４
０′，４０″……ガイド部材、４１，４１′，４
１″……空洞、６０……プリント基板（電子部
品）。
FIG. 1 is a schematic perspective view showing an entire embodiment of a solder processing apparatus according to the present invention, FIG. 2 is an enlarged partial perspective view of a solder attachment part, FIG. 3 is a partial plan view of a rail, and FIG. 4 5 is a cross-sectional view of the rail and the guide member, FIG. 6 is a cross-sectional view of another embodiment of the present invention, and FIG. 7 is a cross-sectional view of the present invention. FIG. 8 is a cross-sectional view in the transverse direction showing still another embodiment of the present invention;
FIGS. 9 to 13 are diagrams showing a comparison of the thermal shock reduction effects of the present invention and the prior art. 10... Supply section, 12... Flux application section,
14...Solder application part, 16...Cleaning part, 18...
Drying section, 20... Collection section, 22... Moving mechanism, 2
4...Guide mechanism, 26, 26'...Electronic components,
30, 30'...Rail, 30A...Supporting protrusion, 30B...Solder stopper part, 31, 31'
...Cavity, 32,32'...Lead part, 40,4
0', 40''...Guide member, 41, 41', 4
1″...Cavity, 60...Printed circuit board (electronic component).
Claims (1)
さんで半田処理を行う半田処理方法であつて、前
記レールによつて前記半導体製品の本体下面部を
支持し、前記ガイド部材は前記半導体製品の本体
上面部に半田が被着しないように前記半導体製品
本体上面部及び半導体製品本体上面部近傍の両側
面部に覆うように形成され、前記レール及び前記
ガイド部材を半田で浸した状態で半田処理を行う
半田処理方法。 ２ 前記レールとガイド部材間の前記複数の半導
体製品を送りピンによつて搬出しながら半田処理
する特許請求の範囲第１項記載の半田処理方法。[Scope of Claims] 1. A soldering method in which a plurality of semiconductor products are sandwiched between a rail and a guide member, and the lower surface of the main body of the semiconductor product is supported by the rail, and the guide member is A state in which the rail and the guide member are soaked in solder is formed to cover the top surface of the semiconductor product body and both side surfaces near the top surface of the semiconductor product body so that solder does not adhere to the top surface of the semiconductor product body. A soldering method that performs soldering. 2. The soldering method according to claim 1, wherein the plurality of semiconductor products between the rail and the guide member are soldered while being carried out by a feed pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4084782A JPS58158992A (en) | 1982-03-17 | 1982-03-17 | Solder treating device for electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4084782A JPS58158992A (en) | 1982-03-17 | 1982-03-17 | Solder treating device for electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58158992A JPS58158992A (en) | 1983-09-21 |
| JPH0142504B2 true JPH0142504B2 (en) | 1989-09-13 |
Family
ID=12591971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4084782A Granted JPS58158992A (en) | 1982-03-17 | 1982-03-17 | Solder treating device for electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58158992A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60105292A (en) * | 1983-11-14 | 1985-06-10 | 近藤 権士 | Full automatic soldering device for ic |
| JPS60106663A (en) * | 1983-11-14 | 1985-06-12 | Kenji Kondo | Fully automatic soldering device for ic |
| JPS6260248A (en) * | 1985-07-30 | 1987-03-16 | サン、インダストリアル、コ−テイングス、プライベ−ト、リミテツド | Holding device for soldering electric or electronic part |
| JPH0438528Y2 (en) * | 1989-12-06 | 1992-09-09 | ||
| JPH05269574A (en) * | 1991-11-19 | 1993-10-19 | Sun Ind Coatings Pte Ltd | Device for holding electrical or electronic parts during soldering |
| JP4578558B2 (en) | 2008-06-12 | 2010-11-10 | パナソニック株式会社 | Method for manufacturing objective lens actuator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5691456A (en) * | 1979-12-25 | 1981-07-24 | Toshiba Corp | Soldering device for resin-sealed semiconductor |
| JPS577145A (en) * | 1980-06-16 | 1982-01-14 | Toshiba Corp | Soldering method of terminal for electronic parts |
| JPS5740848A (en) * | 1980-08-25 | 1982-03-06 | Sankusu:Kk | Discharge tube |
-
1982
- 1982-03-17 JP JP4084782A patent/JPS58158992A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5691456A (en) * | 1979-12-25 | 1981-07-24 | Toshiba Corp | Soldering device for resin-sealed semiconductor |
| JPS577145A (en) * | 1980-06-16 | 1982-01-14 | Toshiba Corp | Soldering method of terminal for electronic parts |
| JPS5740848A (en) * | 1980-08-25 | 1982-03-06 | Sankusu:Kk | Discharge tube |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58158992A (en) | 1983-09-21 |
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