JPS60106663A - Fully automatic soldering device for ic - Google Patents

Abstract

PURPOSE:To improve workability and productivity by providing a delivery device on which plural pieces of ICs to be soldered are placed and which delivers intermittently the ICs to conveying rails, etc. and making all the conveying mechanism in soldering automatic. CONSTITUTION:A titled device consists of conveying rails 6 which convey ICs to be soldered, a conveying chain 10, a pickling tank 14 and rinsing tank 15 which clean the ICs, a fluxer 16 and solder tank 18, a rinsing tank 19 which cleans the ICs subjected to soldering and further a delivery device 7, pawls 12 provided to the chain 10 to push and convey the ICs thereon and a housing device 27. The device 7, on which the plural ICs to be soldered are placed, delivers intermittently the ICs to the rails 6. All the conveying mechanisms are automated by the above-mentioned device, by which workability and productivity are improved.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a fully automatic soldering device for five ICs that automatically performs soldering to lead terminals of an IC.

As is well known, it prevents oxidation of IC lead terminals and
&In order to easily and reliably perform soldering after mounting on a printed circuit board, the lead terminals are soldered in advance.

By the way, conventionally, when soldering IC lead terminals, the IC was manually attached to a jig attached to a carrier.
y] pieces were placed one by one, and this jig was further attached to the carrier. In addition, even after soldering is completed on the lead terminals, it is still necessary to manually remove the chipped jig from the carrier and remove the IC from the jig.
'& Because it was removed one by one, it required a lot of manual labor [2] and was time-consuming. Therefore, there were disadvantages such as poor soldering workability (high costs).

This invention was made in order to eliminate the above-mentioned drawbacks, and the case containing the IC is simply placed on the soldering device, and the subsequent sending, transporting, pickling, and
It provides a soldering system that automatically performs all processes such as franking, soldering, cleaning, drying, and storage. This invention will be explained below.

FIGS. 1(a) and 1(b) are a plan view and a side view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a case in which an IC is housed. In these figures, 1 indicates the entire fully automatic IC soldering device.

2 is ICl3 the lead terminal of the IC2, 4 is the IC
2 is housed in a line in the longitudinal direction, the case is made of synthetic resin and is open at both ends, and has an appropriate length l. 5 is a base of the fully automatic IC soldering apparatus 1, and a plurality of cases 4 are arranged in parallel at the end thereof. 6 is an air cylinder serving as a driving source for the delivery device 7, and 9 is a plurality of rods that are moved forward and backward by the air cylinder 8, and are arranged in parallel. Reference numeral 10 denotes an endless conveyor chino, which is formed so that the reciprocating paths are vertically overlapped as shown in FIG. The vehicle is simultaneously driven intermittently by a drive device (not shown). Reference numeral 11 denotes a subrokent, and 12 a claw for pushing the rear end of the IC 2 on the transport knoll 6 to transport it, which are arranged at a pitch p corresponding to the length l of the case 4. Reference numeral 13 denotes a mounting plate for the mold 12, and both ends thereof are attached to the conveying chino 10, respectively. Reference numeral 14 denotes an acid cleaning unit for removing dirt and the like attached to the IC 2, 15 a water cleaning tank for washing away the acid attached in the acid cleaning phase 14, 16 a fluxer for processing the cleaned IC 2′, and 17 a preheating unit. A container can be provided as needed. 18 is a jet type soldering pot, 19 is a water cleaning tank for cleaning the IC 2 after soldering, and 2o is a hot water cleaning tank, in which water is used as necessary. 21 is a finishing cleaning tank with water, 22 is a heater for drying, 23 is a movable rail on which the soldered IC 2 is placed, 24 is a movable stand to which the movable knoll 23 is attached, and the tip end is connected to the base 5. The rear end is rotatably connected to the F cylinder 25.
ρrad 26 is rotatably connected. Then, the movable table 24 is rotated to an inclined position with its tip as an intersection 2 in a direction opposite to the transport direction of the IC 2 and is in a descending state. 2
Reference numeral 7 denotes a storage device 4.7 to be stored in the IC2Y case 4 on the movable table 24. Shows the whole. 28 is an air cylinder, 2
Reference numeral 9 indicates a plurality of ps that are moved by the drive of the air cylinder 28.
RAD 30 is a claw attached to the tip of each of the PRADs 29, and pushes the rear end of the IC 2 to house it in the case 4.

FIG. 3 is a partially enlarged plan view of the delivery device B7 and conveyor/ru 6 shown in FIG. 1, and FIGS. 4(a) and 4(b) are 1. C2
Figure 4 (al is shown in Figure 1) shows the mechanism for conveying the
b) Enlarged side view of the X part, Fig. 4(b) is the same as Fig. 4(a)
FIG. 2 is an enlarged cross-sectional view taken along line l-1 of

In these figures, the same reference numerals as in FIGS. 1 and 2 indicate the same parts, 31 is a support body that supports the plurality of irons 9, and 32 is a guide body, which is a transparent body through which the rod 9 is partially extended and guided. A hole 33 is formed to prevent the iron 9 from shaking.

Reference numeral 34 denotes long guide plates extending from the upper part of the conveying knoll 6, which are arranged in parallel, and a slit 35 through which the pawl 12 passes is formed between adjacent guide plates 340. Reference numeral 36 denotes a holding plate that fixes the end of the guide plate 34.

In addition, FIG. 4(c) is a cross-sectional view of another shape of the guide plate, and 34A is a guide plate with a step formed therein, which is used for a case where the height of work C2A is increased. 3A is a lead terminal, 3
5A is a slit through which the mold 12 passes.

FIG. 5 is an enlarged side view of the storage device 27 shown in FIG. 1, and the same reference numerals as in FIGS.
Reference numeral 7 denotes a fulcrum of the movable base 24, on which a movable base 247 is rotatably supported.

Next, the operation will be explained.

First, an outline of the operation of the fully automatic IC soldering apparatus 1 will be explained with reference to FIGS. 1(a) and 2(b) and FIG.

The ICs 2 arranged in the case 4 are driven by the F-cylinder 8 so that the rear ends of the ICs 2 are elongated at the tip of the p-rad 9, sent out in the direction of the arrow, and placed on the conveyor knoll 6.

Next, as the conveyor cheno 100 travels, the pawl 12 descends,
Push the rear end of IC2 and move IC2& to the next stage acid cleaning tank 14.
Transport. Next, acid cleaning tank 14° water cleaning J9'+ 1
5, Fluxa 16. Each process is performed while repeating temporary stops due to intermittent movement of the carrier element 10 at the position of the preheater 17. Next, the IC 2 is soldered at the solder spots 18. Further, when the IC 2 passes over the solder bath 1B, it can be moved without a temporary stop in order to prevent the IC 2 from being overheated by the solder melt. To do this, I
The solder cake 18 is disposed at a position where C2 can be continuously moved even by intermittent movement of the conveyance cheno 10.

In the upper part of the solder tank 18, the conveying knoll 6 becomes a wire knoll, so that the solder melt can sufficiently stick to the lead terminals 3 of the IC2. Next, water washing vagina 11
9. Hot water cleaning tank 20. The final cleaning tank 21 and the drying heater 22 are used to temporarily stop each process. Then, after placing the IC2 on the movable/ru 23, the claw 12 rises as the conveyance engine 10 runs, and disengage.

Next, when the rod 26 is lowered by driving the air cylinder 25, the movable base 24 tilts by 1. Next, as the air cylinder 28 is operated, the claw 3° of the rod 29 pushes the rear end of the IC 2, so that the IC 2 is housed in the case 4. Then,
The pawl 30 is moved backward by the operation of the F cylinder 28, and then the movable base 24 is returned to its original position by driving the air cylinder 25).

Next, the transport mechanism of the IC 2 will be explained with reference to FIGS. 3, 4, and 5.

First, in FIG. 3, the case 4 containing the IC 2 is placed on the base 5 manually or automatically.

Next, the rod 9 is moved in the direction of the arrow A by the drive of the F cylinder 8, and the tip of the valley rod 9 pushes the rear end of the IC2 to move it from the IC27 case 4 to the storage nozzle 6. At this time, the tip of the rod 9 moves to a position where the claw 12 of the transporting cheno 1o can push the rear end of the IC 2 on the transporting/ruling 6, as shown in FIG. After this, the rod 9 returns to its original position, and then the empty case 4 on the base 5 is removed and the case 4 containing the IC 2 is placed therein.

Next, the claw 12 descends in the direction of arrow B and enters the slit 35 as the conveyor cheno 1o travels, pushing the rear end of the IC 2 and moving it to the next stage of the acid cleaning tank 14 at a pitch p as shown in FIG.
Move and stop. In this way, the claws 12 repeatedly move intermittently to transfer the IC2, and after performing a soldering process on the IC2, the IC2' is placed on the movable knoll 23.

Next, when the p-rad 26 is lowered by the drive of the F-cylinder 25, the movable base 24 is lowered in the direction of arrow C about the fulcrum 31 and stopped at the diagonal position indicated by the two-dot chain line in the figure. Next, the rod 29 moves in the direction of the arrow by driving the F-cylinder 2B, pushes the rear end of the IC2 with the claw 3°, and places the IC2 into the empty case 4 that has been placed on the movable table 24 in advance. be stored. Next, the prad 29 moves in the opposite direction to the arrow direction and returns to its original position. At 1:1j, the pawl 12 rises in the direction of the arrow E, and then, when the rod 26 is raised by the drive of the F cylinder 25, the movable base 24 rises and wanders to the original disaster line position Ii&X1+.

Next, the case 4 containing the IC 2 is removed manually or automatically, and the subsequent empty case 4 is placed.

As explained above, the present invention includes a device for fully automatic soldering for ICs, which includes a device for placing solder IC's (several IC's) and intermittently sending them out to a transportation mail, and a device for pushing ICCs on a transportation rail. After the soldered IC is transferred to the movable knoll, the movable knoll is tilted and the IC is removed by a drive device.
Since we have installed a storage device to store the soldering parts in the storage section, all the transport mechanisms for soldering can be automated, and this has the advantage of being equipped with excellent fully automatic soldering equipment for ICs that is highly workable and highly productive. has.

[Brief explanation of the drawing]

FIGS. 1(a) and (b) are a plan view and a side view showing an embodiment of the present invention, FIG. 2 is a perspective view showing a case in which an IC is housed, and FIG. a) Delivery device and conveyance/-
4(a) and (b).
) shows the mechanism for ICV transport; FIG. 4(a) is an enlarged side view of the X section in FIG. 1(b), and FIG.
A cross-sectional view taken along the line 1-1 in Figure (a), Figure 4 (e) is the 4th
FIG. 5 is a sectional view showing another shape of the guide plate in FIG. 1(b), and FIG. 5 is an enlarged sectional view showing the storage device in FIG. 1(b). In the figure, 1 is a device for fully automatic IC soldering, and 2 is an ICl3
is a lead terminal, 4 is a case, 5 is a base, 6 is a conveyor V-ru, 7 is a delivery device, 8 is an F cylinder, 9 is a rond, 10
is a conveyor chain, 11 is a sprocket, 12 is a pawl, 13 is a mounting plate, 14 is an acid cleaning tank, 15 is a water cleaning unit, 16 is a fluxer, 17 is a preheater, 1B is a soldering shield, 19 is a water cleaning tank, 20 is a hot water cleaning tank, 21 is a final cleaning tank of 0.2
2 is a heater, 23 is a movable V-ru, 24 is a movable base, 25 is an air cylinder, 26 is a prad, 2γ is a storage device, 2B is an air cylinder, 29 is a rond, 3o is a claw, 31 is a support, 32 33 is a guide hole, 34 is a guide plate, 35 is a slit, 36 is a holding plate, and 37 is a fulcrum.

Claims (1)

[Claims] A conveyance wheel for conveying the ICY to be soldered, a conveyance cheno for intermittently conveying the ICY, an acid cleaning bath and a water cleaning bath for cleaning the IC before soldering, and the cleaned ICY franks treatment. A fluxer to be soldered, a soldering bath to process the soldering, the ICy after soldering, a water washing tank to be cleaned, and a fully automatic soldering device which is arranged in sequence with a fire, are used to solder the IC to be soldered. a sending device for placing a plurality of ICs on the transport knoll and intermittently sending the ICs to the transport knurl; a claw provided on the transport cheno for pushing and transporting the IC on the transport knoll; and a soldered movable ICY movable rule transport device. After that, the device is equipped with a storage device that tilts the movable V-ru and stores the IC in the storage section using a drive device.