JPH0142468B2 - - Google Patents
Info
- Publication number
- JPH0142468B2 JPH0142468B2 JP57118104A JP11810482A JPH0142468B2 JP H0142468 B2 JPH0142468 B2 JP H0142468B2 JP 57118104 A JP57118104 A JP 57118104A JP 11810482 A JP11810482 A JP 11810482A JP H0142468 B2 JPH0142468 B2 JP H0142468B2
- Authority
- JP
- Japan
- Prior art keywords
- support layer
- insulating support
- metal terminal
- circuit pattern
- lug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 31
- 229920005992 thermoplastic resin Polymers 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 7
- 229920001169 thermoplastic Polymers 0.000 claims description 6
- 239000004416 thermosoftening plastic Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 23
- 239000011247 coating layer Substances 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000002788 crimping Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57118104A JPS599880A (ja) | 1982-07-07 | 1982-07-07 | 金属端子の取付構造及び取付方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57118104A JPS599880A (ja) | 1982-07-07 | 1982-07-07 | 金属端子の取付構造及び取付方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS599880A JPS599880A (ja) | 1984-01-19 |
| JPH0142468B2 true JPH0142468B2 (enrdf_load_stackoverflow) | 1989-09-12 |
Family
ID=14728107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57118104A Granted JPS599880A (ja) | 1982-07-07 | 1982-07-07 | 金属端子の取付構造及び取付方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS599880A (enrdf_load_stackoverflow) |
-
1982
- 1982-07-07 JP JP57118104A patent/JPS599880A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS599880A (ja) | 1984-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR940011645B1 (ko) | 박층 프린트 코일 구조 | |
| US5952713A (en) | Non-contact type IC card | |
| KR0169554B1 (ko) | 비접촉 ic카드, 그의 제조방법 및 제조장치 | |
| US6782615B2 (en) | Method of surface-mounting electronic components | |
| JP3882540B2 (ja) | プリント基板の製造方法およびその製造方法によって形成されるプリント基板 | |
| US4164071A (en) | Method of forming a circuit board with integral terminals | |
| JPH0142468B2 (enrdf_load_stackoverflow) | ||
| JP4552486B2 (ja) | 面状発熱体 | |
| JPH09129284A (ja) | 平面回路体の端末接続部およびその製造方法 | |
| JPH10106726A (ja) | 面状発熱体の製造方法 | |
| JP3358946B2 (ja) | 配線板に導電バンプを形成する方法 | |
| JPS6011402B2 (ja) | 異方導電性シ−ト | |
| JPS587078B2 (ja) | プリントバンノ タンシセツゾクホウホウ | |
| JPH0492377A (ja) | 電線の接続部 | |
| JPS5855671Y2 (ja) | 配線基板 | |
| JPH0534134Y2 (enrdf_load_stackoverflow) | ||
| JPH0582596A (ja) | リードフレーム | |
| JP2613846B2 (ja) | 電極シート片付きチップ型電子部品 | |
| JP2954559B2 (ja) | 配線基板の電極構造 | |
| JP3844716B2 (ja) | 回路体、該回路体の製造方法および該回路体を備えた自動車用電気接続箱 | |
| JPH0572551A (ja) | 表示素子の端子接続方法 | |
| JPH0750818B2 (ja) | フレキシブル回路基板及びそのスルーホール部の形成方法 | |
| JPH1041600A (ja) | 端子付フレキシブル配線基板 | |
| JP3486104B2 (ja) | フィルム回路の接続構造 | |
| JP2560552B2 (ja) | 印刷配線板の断線修理方法 |