JPH0142381Y2 - - Google Patents

Info

Publication number
JPH0142381Y2
JPH0142381Y2 JP12122883U JP12122883U JPH0142381Y2 JP H0142381 Y2 JPH0142381 Y2 JP H0142381Y2 JP 12122883 U JP12122883 U JP 12122883U JP 12122883 U JP12122883 U JP 12122883U JP H0142381 Y2 JPH0142381 Y2 JP H0142381Y2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
case
waterproof filler
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12122883U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6030569U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12122883U priority Critical patent/JPS6030569U/ja
Publication of JPS6030569U publication Critical patent/JPS6030569U/ja
Application granted granted Critical
Publication of JPH0142381Y2 publication Critical patent/JPH0142381Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
JP12122883U 1983-08-02 1983-08-02 ポツテイングしたプリント基板の構造 Granted JPS6030569U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12122883U JPS6030569U (ja) 1983-08-02 1983-08-02 ポツテイングしたプリント基板の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12122883U JPS6030569U (ja) 1983-08-02 1983-08-02 ポツテイングしたプリント基板の構造

Publications (2)

Publication Number Publication Date
JPS6030569U JPS6030569U (ja) 1985-03-01
JPH0142381Y2 true JPH0142381Y2 (en, 2012) 1989-12-12

Family

ID=30277544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12122883U Granted JPS6030569U (ja) 1983-08-02 1983-08-02 ポツテイングしたプリント基板の構造

Country Status (1)

Country Link
JP (1) JPS6030569U (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009272414A (ja) * 2008-05-07 2009-11-19 Honda Motor Co Ltd 電子回路の保護構造及びその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613841Y2 (ja) * 1989-08-11 1994-04-13 株式会社イナックス 便器用コントロールボックス
JP4710062B2 (ja) * 2004-08-11 2011-06-29 東芝ライテック株式会社 電子機器、点灯装置、及び照明器具
JP2017069367A (ja) * 2015-09-30 2017-04-06 アール・ビー・コントロールズ株式会社 電子装置
JP6419125B2 (ja) * 2016-10-05 2018-11-07 日立オートモティブシステムズ株式会社 電子制御装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009272414A (ja) * 2008-05-07 2009-11-19 Honda Motor Co Ltd 電子回路の保護構造及びその製造方法

Also Published As

Publication number Publication date
JPS6030569U (ja) 1985-03-01

Similar Documents

Publication Publication Date Title
KR100231086B1 (ko) 관통 슬릿이 형성된 다이패드를 포함하는 반도체 칩 패키지
JPH0142381Y2 (en, 2012)
IE802038L (en) Integrated circuit package
JPH0317220B2 (en, 2012)
US20020079438A1 (en) Image sensor package and substrate thereof
JPH0230597A (ja) 半導体カード用モジュール
JP3428075B2 (ja) ハイブリッド集積回路装置の構造
US5256903A (en) Plastic encapsulated semiconductor device
JPH054273Y2 (en, 2012)
JPS6020929Y2 (ja) 電気回路素子の封止枠構造
JPS5849639Y2 (ja) 混成集積回路
JPH0536296Y2 (en, 2012)
JPH0526761Y2 (en, 2012)
JPS6032396A (ja) 電子制御装置
JPH0536274Y2 (en, 2012)
FI3459325T3 (fi) Menetelmä sähköisen yksikön päällystämiseksi ja sähkökomponentti
KR0156335B1 (ko) 타이 바를 이용한 반도체 칩 패키지
JPH046209Y2 (en, 2012)
JPH05166967A (ja) 半導体装置
JPH0779149B2 (ja) 樹脂封止型半導体装置
JPH0416452Y2 (en, 2012)
JPS62229860A (ja) Ｉｃの封止構造
JPH02246143A (ja) リードフレーム
JPS6292345A (ja) 樹脂封止型半導体装置
JPH0236280Y2 (en, 2012)