JPH0140203Y2 - - Google Patents
Info
- Publication number
- JPH0140203Y2 JPH0140203Y2 JP12558680U JP12558680U JPH0140203Y2 JP H0140203 Y2 JPH0140203 Y2 JP H0140203Y2 JP 12558680 U JP12558680 U JP 12558680U JP 12558680 U JP12558680 U JP 12558680U JP H0140203 Y2 JPH0140203 Y2 JP H0140203Y2
- Authority
- JP
- Japan
- Prior art keywords
- plug
- printed circuit
- solder
- pin
- handle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 230000008595 infiltration Effects 0.000 claims description 3
- 238000001764 infiltration Methods 0.000 claims description 3
- 235000010585 Ammi visnaga Nutrition 0.000 description 4
- 244000153158 Ammi visnaga Species 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001234 light alloy Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12558680U JPH0140203Y2 (en)van) | 1980-09-05 | 1980-09-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12558680U JPH0140203Y2 (en)van) | 1980-09-05 | 1980-09-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5748675U JPS5748675U (en)van) | 1982-03-18 |
JPH0140203Y2 true JPH0140203Y2 (en)van) | 1989-12-01 |
Family
ID=29486050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12558680U Expired JPH0140203Y2 (en)van) | 1980-09-05 | 1980-09-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0140203Y2 (en)van) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6358864B2 (ja) * | 2014-06-11 | 2018-07-18 | 三菱電機株式会社 | 電子回路基板およびその製造方法、ならびに電気機器 |
-
1980
- 1980-09-05 JP JP12558680U patent/JPH0140203Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5748675U (en)van) | 1982-03-18 |
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