JPH0140198Y2 - - Google Patents

Info

Publication number
JPH0140198Y2
JPH0140198Y2 JP1983053935U JP5393583U JPH0140198Y2 JP H0140198 Y2 JPH0140198 Y2 JP H0140198Y2 JP 1983053935 U JP1983053935 U JP 1983053935U JP 5393583 U JP5393583 U JP 5393583U JP H0140198 Y2 JPH0140198 Y2 JP H0140198Y2
Authority
JP
Japan
Prior art keywords
lead frame
block body
substrate
adhesion
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983053935U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59159947U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983053935U priority Critical patent/JPS59159947U/ja
Publication of JPS59159947U publication Critical patent/JPS59159947U/ja
Application granted granted Critical
Publication of JPH0140198Y2 publication Critical patent/JPH0140198Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1983053935U 1983-04-11 1983-04-11 半導体装置の製造装置 Granted JPS59159947U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983053935U JPS59159947U (ja) 1983-04-11 1983-04-11 半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983053935U JPS59159947U (ja) 1983-04-11 1983-04-11 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPS59159947U JPS59159947U (ja) 1984-10-26
JPH0140198Y2 true JPH0140198Y2 (enFirst) 1989-12-01

Family

ID=30184287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983053935U Granted JPS59159947U (ja) 1983-04-11 1983-04-11 半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPS59159947U (enFirst)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2581054B2 (ja) * 1987-02-18 1997-02-12 三菱電機株式会社 半導体製造装置

Also Published As

Publication number Publication date
JPS59159947U (ja) 1984-10-26

Similar Documents

Publication Publication Date Title
US5902959A (en) Lead frame with waffled front and rear surfaces
EP0712158B1 (en) Resin sealing type semiconductor device with cooling member and method of making the same
JPH0140198Y2 (enFirst)
JPH08139218A (ja) 混成集積回路装置およびその製造方法
JPH038113B2 (enFirst)
JPS59207646A (ja) 半導体装置およびリ−ドフレ−ム
JPH03278451A (ja) 樹脂封止型半導体装置及びその製造方法
JP2629460B2 (ja) 混成集積回路装置
JPH019158Y2 (enFirst)
JPH043501Y2 (enFirst)
JPS6297341A (ja) ボンディング装置及びボンディング方法
JPH11340373A (ja) 薄小型樹脂封止パッケージ
JPS5843233Y2 (ja) 半導体装置
JPS60178636A (ja) 半導体装置
JPS63221634A (ja) 半導体ペレツトの固定方法
JPS6228780Y2 (enFirst)
JPH03238851A (ja) 大電力絶縁樹脂封止型半導体装置
JPH07202112A (ja) リードフレーム組立体
JPS6147649A (ja) 半導体装置およびその製造方法
JPH0722534A (ja) 半導体装置
JPS6173344A (ja) 半導体装置
JPH05218271A (ja) Ｉｃパッケージ
JPS6092648A (ja) バンプ形成用基板およびこれを用いたバンプ形成方法
JPS6155778B2 (enFirst)
JP2001127098A (ja) 半導体装置及びその製造方法、製造装置、回路基板並びに電子機器