JPH0136976B2 - - Google Patents
Info
- Publication number
- JPH0136976B2 JPH0136976B2 JP59056290A JP5629084A JPH0136976B2 JP H0136976 B2 JPH0136976 B2 JP H0136976B2 JP 59056290 A JP59056290 A JP 59056290A JP 5629084 A JP5629084 A JP 5629084A JP H0136976 B2 JPH0136976 B2 JP H0136976B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- silicon substrate
- silicon
- film
- quartz glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 54
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 34
- 229910052710 silicon Inorganic materials 0.000 claims description 34
- 239000010703 silicon Substances 0.000 claims description 34
- 239000004065 semiconductor Substances 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 12
- 238000010894 electron beam technology Methods 0.000 claims description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
- 229910052721 tungsten Inorganic materials 0.000 description 7
- 239000010937 tungsten Substances 0.000 description 7
- 238000000137 annealing Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59056290A JPS60200517A (ja) | 1984-03-26 | 1984-03-26 | 半導体加熱方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59056290A JPS60200517A (ja) | 1984-03-26 | 1984-03-26 | 半導体加熱方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60200517A JPS60200517A (ja) | 1985-10-11 |
JPH0136976B2 true JPH0136976B2 (zh) | 1989-08-03 |
Family
ID=13022965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59056290A Granted JPS60200517A (ja) | 1984-03-26 | 1984-03-26 | 半導体加熱方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60200517A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62208586A (ja) * | 1986-03-08 | 1987-09-12 | 東京エレクトロン相模株式会社 | 加熱器 |
-
1984
- 1984-03-26 JP JP59056290A patent/JPS60200517A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60200517A (ja) | 1985-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4482393A (en) | Method of activating implanted ions by incoherent light beam | |
JP3008192B2 (ja) | 化学気相蒸着の加熱装置 | |
WO1993019484A1 (en) | Rapid thermal annealing using thermally conductive overcoat | |
US4474831A (en) | Method for reflow of phosphosilicate glass | |
US4535227A (en) | Method for heating semiconductor wafer by means of application of radiated light | |
US4504730A (en) | Method for heating semiconductor wafer by means of application of radiated light | |
JPS6244848B2 (zh) | ||
JPH0136976B2 (zh) | ||
JPH027415A (ja) | Soi薄膜形成方法 | |
JPH07201753A (ja) | 薄膜製造方法およびその装置 | |
JP2686498B2 (ja) | 半導体製造装置 | |
JPS60239400A (ja) | 化合物半導体のアニ−ル法 | |
JPH07194965A (ja) | 成膜方法及び成膜装置 | |
JPS63241921A (ja) | 分子線エピタキシ装置の基板加熱装置 | |
JP4094127B2 (ja) | アモルファスシリコン製造装置 | |
JPS6175517A (ja) | 化合物半導体基板のアニ−ル法 | |
JPH025295B2 (zh) | ||
JPH05291148A (ja) | 半導体基板の加熱装置および加熱方法 | |
JPS6244847B2 (zh) | ||
JPS6135509A (ja) | 基板加熱方法 | |
JP2633039B2 (ja) | 化合物半導体ウエハの熱処理方法 | |
JPH04289168A (ja) | 薄膜形成用基板保持具 | |
JPS62271420A (ja) | 半導体基体の処理装置 | |
JPH0351091B2 (zh) | ||
JPH02185037A (ja) | 短時間熱処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |