JPH0136690B2 - - Google Patents

Info

Publication number
JPH0136690B2
JPH0136690B2 JP58023805A JP2380583A JPH0136690B2 JP H0136690 B2 JPH0136690 B2 JP H0136690B2 JP 58023805 A JP58023805 A JP 58023805A JP 2380583 A JP2380583 A JP 2380583A JP H0136690 B2 JPH0136690 B2 JP H0136690B2
Authority
JP
Japan
Prior art keywords
film
semiconductor
thin film
substrate
single crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58023805A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59151416A (ja
Inventor
Kazumichi Oomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP2380583A priority Critical patent/JPS59151416A/ja
Publication of JPS59151416A publication Critical patent/JPS59151416A/ja
Publication of JPH0136690B2 publication Critical patent/JPH0136690B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02631Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02488Insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02535Group 14 semiconducting materials including tin
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Recrystallisation Techniques (AREA)
JP2380583A 1983-02-17 1983-02-17 半導体装置の製造方法 Granted JPS59151416A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2380583A JPS59151416A (ja) 1983-02-17 1983-02-17 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2380583A JPS59151416A (ja) 1983-02-17 1983-02-17 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59151416A JPS59151416A (ja) 1984-08-29
JPH0136690B2 true JPH0136690B2 (enrdf_load_stackoverflow) 1989-08-02

Family

ID=12120537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2380583A Granted JPS59151416A (ja) 1983-02-17 1983-02-17 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59151416A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574115A (en) * 1980-06-10 1982-01-09 Nippon Telegr & Teleph Corp <Ntt> Manufacture of junction of semiconductors

Also Published As

Publication number Publication date
JPS59151416A (ja) 1984-08-29

Similar Documents

Publication Publication Date Title
US4500388A (en) Method for forming monocrystalline semiconductor film on insulating film
US4371421A (en) Lateral epitaxial growth by seeded solidification
US6399429B1 (en) Method of forming monocrystalline silicon layer, method for manufacturing semiconductor device, and semiconductor device
US20090176353A1 (en) Crystalline-type device and approach therefor
JPS6158879A (ja) シリコン薄膜結晶の製造方法
JPS6142855B2 (enrdf_load_stackoverflow)
JPH0136690B2 (enrdf_load_stackoverflow)
KR940004450B1 (ko) 반도체장치의 제조방법
JPH04206932A (ja) 半導体装置及びその製造方法
JP2756320B2 (ja) 結晶の形成方法
JP4178619B2 (ja) シリコン層の製造方法および半導体装置の製造方法
JPS5939791A (ja) 単結晶の製造方法
JPS59134819A (ja) 半導体基板の製造方法
JPH0517693B2 (enrdf_load_stackoverflow)
JPH0334847B2 (enrdf_load_stackoverflow)
JP3981782B2 (ja) 半導体装置の製造方法
JPH0832037A (ja) 半導体基板の作製方法
JPS5856405A (ja) 半導体装置の製造方法
JP2981777B2 (ja) 半導体基板の製造方法
JP3978874B2 (ja) 半導体装置の製造方法
JP2699347B2 (ja) 半導体基板の製造方法
JPS5893218A (ja) 半導体薄膜構造の製造方法
JPS5893225A (ja) 半導体薄膜構造の製造方法
JPS6219046B2 (enrdf_load_stackoverflow)
JPH0334533A (ja) 半導体結晶層の製造方法