JPH0135503B2 - - Google Patents
Info
- Publication number
- JPH0135503B2 JPH0135503B2 JP58064316A JP6431683A JPH0135503B2 JP H0135503 B2 JPH0135503 B2 JP H0135503B2 JP 58064316 A JP58064316 A JP 58064316A JP 6431683 A JP6431683 A JP 6431683A JP H0135503 B2 JPH0135503 B2 JP H0135503B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead frame
- metal strip
- lead
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/457—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58064316A JPS59188952A (ja) | 1983-04-11 | 1983-04-11 | リ−ドフレ−ムの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58064316A JPS59188952A (ja) | 1983-04-11 | 1983-04-11 | リ−ドフレ−ムの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59188952A JPS59188952A (ja) | 1984-10-26 |
| JPH0135503B2 true JPH0135503B2 (cg-RX-API-DMAC10.html) | 1989-07-25 |
Family
ID=13254704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58064316A Granted JPS59188952A (ja) | 1983-04-11 | 1983-04-11 | リ−ドフレ−ムの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59188952A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9779966B2 (en) | 2015-08-07 | 2017-10-03 | Shinko Electric Industries Co., Ltd. | Lead frame and semiconductor device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01153653U (cg-RX-API-DMAC10.html) * | 1988-04-01 | 1989-10-23 | ||
| JPH0821663B2 (ja) * | 1989-10-13 | 1996-03-04 | 株式会社三井ハイテック | リードフレームの製造方法 |
| JP5735352B2 (ja) * | 2011-06-06 | 2015-06-17 | 新光電気工業株式会社 | リードフレーム連結体、リードフレームの製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58137209A (ja) * | 1982-02-09 | 1983-08-15 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS5999750A (ja) * | 1982-11-30 | 1984-06-08 | Sumitomo Metal Mining Co Ltd | Ic用リ−ドフレ−ムの製造方法 |
-
1983
- 1983-04-11 JP JP58064316A patent/JPS59188952A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9779966B2 (en) | 2015-08-07 | 2017-10-03 | Shinko Electric Industries Co., Ltd. | Lead frame and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59188952A (ja) | 1984-10-26 |
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