JPH0135454Y2 - - Google Patents
Info
- Publication number
- JPH0135454Y2 JPH0135454Y2 JP1983202275U JP20227583U JPH0135454Y2 JP H0135454 Y2 JPH0135454 Y2 JP H0135454Y2 JP 1983202275 U JP1983202275 U JP 1983202275U JP 20227583 U JP20227583 U JP 20227583U JP H0135454 Y2 JPH0135454 Y2 JP H0135454Y2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- terminal
- flanges
- metal
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000004033 plastic Substances 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 15
- 238000004804 winding Methods 0.000 description 14
- 238000005476 soldering Methods 0.000 description 7
- 239000012212 insulator Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20227583U JPS60113608U (ja) | 1983-12-31 | 1983-12-31 | 高圧コイル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20227583U JPS60113608U (ja) | 1983-12-31 | 1983-12-31 | 高圧コイル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60113608U JPS60113608U (ja) | 1985-08-01 |
| JPH0135454Y2 true JPH0135454Y2 (ko) | 1989-10-30 |
Family
ID=30764724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20227583U Granted JPS60113608U (ja) | 1983-12-31 | 1983-12-31 | 高圧コイル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60113608U (ko) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729291U (ko) * | 1980-07-23 | 1982-02-16 |
-
1983
- 1983-12-31 JP JP20227583U patent/JPS60113608U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729291U (ko) * | 1980-07-23 | 1982-02-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60113608U (ja) | 1985-08-01 |
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