JPH0134374Y2 - - Google Patents
Info
- Publication number
- JPH0134374Y2 JPH0134374Y2 JP1982055943U JP5594382U JPH0134374Y2 JP H0134374 Y2 JPH0134374 Y2 JP H0134374Y2 JP 1982055943 U JP1982055943 U JP 1982055943U JP 5594382 U JP5594382 U JP 5594382U JP H0134374 Y2 JPH0134374 Y2 JP H0134374Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- cylindrical frame
- circuit device
- rod
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Multi-Conductor Connections (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982055943U JPS58158485U (ja) | 1982-04-18 | 1982-04-18 | 回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982055943U JPS58158485U (ja) | 1982-04-18 | 1982-04-18 | 回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58158485U JPS58158485U (ja) | 1983-10-22 |
| JPH0134374Y2 true JPH0134374Y2 (fr) | 1989-10-19 |
Family
ID=30066493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982055943U Granted JPS58158485U (ja) | 1982-04-18 | 1982-04-18 | 回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58158485U (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6129545U (ja) * | 1984-07-26 | 1986-02-22 | ミツミ電機株式会社 | テレビジヨン用チユ−ナ装置 |
| JPH0680919B2 (ja) * | 1989-04-04 | 1994-10-12 | 日本ケミコン株式会社 | 電子部品の構造 |
| JPH0755025Y2 (ja) * | 1990-05-29 | 1995-12-18 | ミツミ電機株式会社 | 回路部品装置 |
| JP2795398B2 (ja) * | 1994-07-25 | 1998-09-10 | 株式会社リコー | 画像記録装置 |
| JP3738892B2 (ja) * | 2000-06-05 | 2006-01-25 | シャープ株式会社 | シャーシ構造 |
| JP4608777B2 (ja) * | 2000-12-22 | 2011-01-12 | 株式会社村田製作所 | 電子部品モジュール |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433022B2 (fr) * | 1975-03-14 | 1979-10-18 | ||
| JPS5544606B2 (fr) * | 1975-02-19 | 1980-11-13 | ||
| JPS5634374B2 (fr) * | 1973-12-06 | 1981-08-10 | ||
| JPS5753587B2 (fr) * | 1974-08-05 | 1982-11-13 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433022U (fr) * | 1977-08-10 | 1979-03-03 | ||
| JPS5544606U (fr) * | 1978-09-14 | 1980-03-24 | ||
| JPS5927104Y2 (ja) * | 1979-08-22 | 1984-08-06 | ミツミ電機株式会社 | 基板回路装置のケ−スカバ−構造 |
| JPS5753587U (fr) * | 1980-09-16 | 1982-03-29 |
-
1982
- 1982-04-18 JP JP1982055943U patent/JPS58158485U/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5634374B2 (fr) * | 1973-12-06 | 1981-08-10 | ||
| JPS5753587B2 (fr) * | 1974-08-05 | 1982-11-13 | ||
| JPS5544606B2 (fr) * | 1975-02-19 | 1980-11-13 | ||
| JPS5433022B2 (fr) * | 1975-03-14 | 1979-10-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58158485U (ja) | 1983-10-22 |
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